CENELEC EN 60749-44 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC EN 60749-21 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
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- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- IEC 60747-5-6 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes - Edition 1.0
- IEC 60749-38 Semiconductor devices – Mechanical and climatic test methods – Part 38: Soft error test method for semiconductor devices with memory - Edition 1.0
- Картотека зарубежных и международных стандартов
