BSI BS EN 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
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- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI PD IEC TR 60721-4-1 Classification of Environmental Conditions - Part 4-1: Guidance for the Correlation and Transformation of Environmental Condition Classes of IEC 60721-3 to the Environmental Tests of IEC 60068 - Storage - AMD 14597: October 10, 2003
- IEC 60068-2-13 Basic Environmental Testing Procedures Part 2: Tests Test M: Low Air Pressure - Edition 4.0
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- IEC 60068-2-13 Basic Environmental Testing Procedures Part 2: Tests Test M: Low Air Pressure - Edition 4.0
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General - Edition 1.0
- BSI BS EN 61193-1 Quality Assessment Systems - Part 1: Registration and Analysis of Defects on Printed Board Assemblies - CORR 13939: May 14, 2002
- BSI BS EN 61192-5 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- Картотека зарубежных и международных стандартов
Ссылается на
- В списке элементов: 30
- IEC 60194 Printed board design, manufacture and assembly - Terms and definitions - Edition 6.0Проект печатной платы, изготовление и блок - Условия и определения - Выпуск 6.0
Карточка документа - IEC 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 4.0Испытания на воздействия окружающих условий - Часть 2-58: Тесты - Тест Td: Методы тестирования для паяемости, сопротивления роспуску металлизации и спаиванию тепла устройств монтажа на поверхность (SMD) - Выпуск 4.0
Карточка документа - BSI BS EN ISO 9453 Soft solder alloys - Chemical compositions and formsСплавы легкоплавкого припоя - Химические составы и формы
Карточка документа - IEC 61190-1-2 Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly - Edition 3.0Присоединяемые материалы для электронного блока – Часть 1-2: Требования для спаивания вставок для высококачественных межсоединений в блоке электроники - Выпуск 3.0
Карточка документа - BSI BS EN 61191-2 Printed Board Assemblies Part 2: Sectional Specification - Requirements for Surface Mount Soldered AssembliesЧасть 2 блоков печатной платы: частная спецификация - требования для монтажа на поверхность спаянные блоки
Карточка документа - BSI BS EN 61191-1 Printed Board Assemblies - Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly TechnologiesБлоки печатной платы - часть 1: универсальная спецификация - требования для спаянных электрических и электронных блоков Используя монтаж на поверхность и связанную технологию сборки
Карточка документа - IEC 61191-2 Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies - Edition 2.0Блоки печатной платы – Часть 2: Частная спецификация – Требования для монтажа на поверхность спаяли блоки - Выпуск 2.0
Карточка документа - IEC 61191-1 Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies - Edition 2.0Блоки печатной платы – Часть 1: Универсальная спецификация – Требования для спаянных электрических и электронных блоков с помощью монтажа на поверхность и связанной технологии сборки - Выпуск 2.0
Карточка документа - IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated ReprintПрисоединяемые материалы для электронного блока – Часть 1-3: Требования для электронных припоев класса и текли и нетекли твердые припои для электронных приложений спаивания - Выпуск 2.1 Объединенная Перепечатка
Карточка документа - IEC TR 61340-5-2 CORR 1 CORRIGENDUM 1 Part 5-2: Protection of electronic devices from electrostatic phenomena – User guide - Edition 1.0Часть 5-2 CORRIGENDUM 1: Защита электронных устройств от электростатических явлений – Руководство пользователя - Издание 1.0
Карточка документа - BSI BS EN 61340-5-1 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirementsЭлектростатика - Часть 5-1: Защита электронных устройств от электростатических явлений - Общие требования
Карточка документа - BSI PD CLC/TR 61340-5-2 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide - CORR: June 30, 2011Электростатика - Часть 5-2: Защита электронных приборов от электростатических явлений - Руководство пользователя - CORR: 30 июня 2011
Карточка документа - BSI BS EN 61189-3 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)Методы тестирования для электрических материалов, печатных плат и других структур межсоединений и блоков - Часть 3: Методы тестирования для структур межсоединений (печатные платы)
Карточка документа - IEC 61189-3 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3: Test methods for interconnection structures (printed boards) - Edition 2.0Методы тестирования для электрических материалов, печатных плат и других структур межсоединений и блоков – Часть 3: Методы тестирования для структур межсоединений (печатные платы) - Выпуск 2.0
На основе IEC 61189-3 разработан ГОСТ IEC 61189-3-2013 (IDT)ГОСТ IEC 61189-3-2013 (IDT) - IEC 61340-5-1 Electrostatics – Part 5-1: Protection of electronic devices from electrostatic phenomena – General requirements - Edition 1.0Электростатика – Часть 5-1: Защита электронных приборов от электростатических явлений – Общих требований - Издание 1.0
На основе IEC 61340-5-1 разработан ГОСТ Р 53734.5.1-2009 (MOD)ГОСТ Р 53734.5.1-2009 (MOD) - BSI BS EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guideТехнология монтажа на поверхность - Часть 2: Транспортировка и условия хранения устройств монтажа на поверхность (SMD) - Руководство по приложениям
Карточка документа - IEC 61760-2 Surface mounting technology – Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide - Edition 2.0Технология монтажа на поверхность – Часть 2: Транспортировка и условия хранения устройств монтажа на поверхность (SMD) – Руководства по приложениям - Выпуск 2.0
Карточка документа - BSI BS EN 61192-4 Workmanship requirements for soldered electronic assemblies Part 4: Terminal assembliesТребования мастерства для спаянной электронной Части 4 блоков: Терминальные блоки
Карточка документа - BSI BS EN 61192-3 Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assembliesТребования мастерства для спаянной электронной Части 3 блоков: монтажные узлы через дыру
Карточка документа - IEC 61192-2 Workmanship requirements for soldered electronic assemblies Part 2: Surface-mount assemblies - Edition 1.0Требования мастерства для спаянной электронной Части 2 блоков: блоки монтажа на поверхность - Выпуск 1.0
На основе IEC 61192-2 разработан ГОСТ Р МЭК 61192-2-2010 (IDT)ГОСТ Р МЭК 61192-2-2010 (IDT) - IEC 61192-3 Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies - Edition 1.0Требования мастерства для спаянной электронной Части 3 блоков: монтажные узлы через дыру - Выпуск 1.0
На основе IEC 61192-3 разработан ГОСТ Р МЭК 61192-3-2010 (IDT)ГОСТ Р МЭК 61192-3-2010 (IDT) - IEC 61192-4 Workmanship requirements for soldered electronic assemblies Part 4: Terminal assemblies - Edition 1.0Требования мастерства для спаянной электронной Части 4 блоков: Терминальные блоки - Выпуск 1.0
На основе IEC 61192-4 разработан ГОСТ Р МЭК 61192-4-2010 (IDT)ГОСТ Р МЭК 61192-4-2010 (IDT) - BSI BS EN 61190-1-1 Attachment Materials for Electronic Assembly Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics AssemblyПрисоединяемые материалы для электронной части 1-1 блока: требования для спаивания потоков для высококачественных соединений в блоке электроники
Карточка документа - IEC 61190-1-1 Attachmant Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly - Edition 1.0Материалы Attachmant для электронного блока - часть 1-1: требования для спаивания потоков для высококачественных соединений в блоке электроники - выпуск 1.0
Карточка документа - BSI BS EN 61191-4 Printed Board Assemblies - Part 4: Sectional Specification - Requirements for Terminal Soldered AssembliesБлоки печатной платы - часть 4: частная спецификация - требования для терминальных спаянных блоков
Карточка документа - BSI BS EN 61191-3 Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered AssembliesБлоки печатной платы - часть 3: частная спецификация - требования для монтирования через дыру спаянные блоки
Карточка документа - IEC 61191-4 Printed Board Assemblies - Part 4: Sectional Specification - Requirements for Terminal Soldered Assemblies - Edition 1.0Блоки печатной платы - часть 4: частная спецификация - требования для терминальных спаянных блоков - выпуск 1.0
На основе IEC 61191-4 разработан ГОСТ Р МЭК 61191-4-2010 (IDT)ГОСТ Р МЭК 61191-4-2010 (IDT) - IEC 61191-3 Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies - Edition 1.0Блоки печатной платы - часть 3: частная спецификация - требования для монтирования через дыру спаянные блоки - выпуск 1.0
На основе IEC 61191-3 разработан ГОСТ Р МЭК 61191-3-2010 (IDT)ГОСТ Р МЭК 61191-3-2010 (IDT) - BSI BS EN 61188-1-1 Printed Boards and Assemblies - Design and Use Part 1: Generic Requirements Section 1: Flatness Considerations for Electronic AssembliesПечатные платы и блоки - проект и часть 1 использования: универсальный раздел требований 1: соображения плоскости для электронных блоков
Карточка документа - IEC 61188-1-1 Printed Boards and Printed Board Assemblies - Design and Use - Part 1-1: Generic Requirements - Flatness Considerations for Electronic Assemblies - Edition 1.0Печатные платы и блоки печатной платы - проект и использование - часть 1-1: универсальные требования - соображения плоскости для электронных блоков - выпуск 1.0
На основе IEC 61188-1-1 разработан ГОСТ IEC 61188-1-1-2013 (IDT)ГОСТ IEC 61188-1-1-2013 (IDT)
