IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19.040
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 29.020
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-2-2 Environmental testing -- Part 2-2: Tests - Tests B: Dry heat. (IEC 60068-2-2:2007)
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-69 Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - Edition 2.0
- CEI EN 60068-2-83 Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- Картотека зарубежных и международных стандартов
International Electrotechnical Commission
Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
N 61190-1-3
Annotation
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process
Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiplealloy solder powders, etc.
Автоматический перевод:
Присоединяемые материалы для электронного блока – Часть 1-3: Требования для электронных припоев класса и текли и нетекли твердые припои для электронных приложений спаивания - Выпуск 2.1 Объединенная Перепечатка
Эта часть IEC 61190 предписывает требования и методы тестирования для электронных припоев класса, для текшего и нетекла панель, лента, порошковые припои и припойная паста, для электронных приложений спаивания и для "специальных" электронных припоев класса. Для универсальных спецификаций припоев и потоков, посмотрите ISO 9453, ISO 9454-1 и ISO 9454-2. Этот стандарт является документом контроля качества и не предназначается для связи непосредственно к производительности материала в производственном процессе
