BSI BS QC 760200 Harmonized System of Quality Assessment for Electronic Components Semiconductor Devices - Integrated Circuits - Sectional Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- DIN EN 1012-3 Compressors and vacuum pumps - Safety requirements - Part 3: Process compressors
- CEN EN 626-1 Safety of machinery - Reduction of risks to health from hazardous substances emitted by machinery - Part 1: Principles and specifications for machinery manufacturers - Incorporates Amendment A1: 2008
- BSI BS EN 953 + A1 Safety of machinery - Guards - General requirements for the design and construction of fixed and movable guards - AMD: April 30, 2009
- BSI BS EN 1012-1 Compressors and vacuum pumps - Safety requirements Part 1: Air compressors
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN 1012-1 Compressors and vacuum pumps - Safety requirements Part 1: Air compressors
- BSI BS EN 953 + A1 Safety of machinery - Guards - General requirements for the design and construction of fixed and movable guards - AMD: April 30, 2009
- CEN EN 626-1 Safety of machinery - Reduction of risks to health from hazardous substances emitted by machinery - Part 1: Principles and specifications for machinery manufacturers - Incorporates Amendment A1: 2008
- CEN EN 626-1 Safety of machinery - Reduction of risks to health from hazardous substances emitted by machinery - Part 1: Principles and specifications for machinery manufacturers - Incorporates Amendment A1: 2008
- BSI BS EN 953 + A1 Safety of machinery - Guards - General requirements for the design and construction of fixed and movable guards - AMD: April 30, 2009
- BSI BS EN 1012-1 Compressors and vacuum pumps - Safety requirements Part 1: Air compressors
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN 1012-1 Compressors and vacuum pumps - Safety requirements Part 1: Air compressors
- BSI BS EN 953 + A1 Safety of machinery - Guards - General requirements for the design and construction of fixed and movable guards - AMD: April 30, 2009
- BSI BS EN 953 + A1 Safety of machinery - Guards - General requirements for the design and construction of fixed and movable guards - AMD: April 30, 2009
- BSI BS EN 1012-1 Compressors and vacuum pumps - Safety requirements Part 1: Air compressors
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN 1012-1 Compressors and vacuum pumps - Safety requirements Part 1: Air compressors
- BSI BS EN 1012-1 Compressors and vacuum pumps - Safety requirements Part 1: Air compressors
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- CEI EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995
- BSI BS QC 760200 Harmonized System of Quality Assessment for Electronic Components Semiconductor Devices - Integrated Circuits - Sectional Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures
- BSI BS QC 760201 Harmonized System of Quality Assessment for Electronic Components Semiconductor Devices - Integrated Circuits - Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures
- DIN EN 1012-3 Compressors and vacuum pumps - Safety requirements - Part 3: Process compressors
- Картотека зарубежных и международных стандартов
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- IEC 60068-1 Environmental Testing Part 1: General and Guidance - Edition 7.0Часть 1 испытаний на воздействия окружающих условий: общий и руководство - издание 7.0
Карточка документа - IEC 60440 Method of measurement of non-linearity in resistors - Edition 1.0Метод измерения нелинейности в резисторах - Выпуск 1.0
Карточка документа - BSI BS QC 760201 Harmonized System of Quality Assessment for Electronic Components Semiconductor Devices - Integrated Circuits - Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval ProceduresСогласованная система качественной оценки для устройств полупроводника электронных компонентов - интегральных схем - пробел детализирует спецификацию для пленочных интегральных схем и гибридных пленочных интегральных схем на основе процедур одобрения возможности
Карточка документа - BSI BS QC 760100 Harmonized System of Quality Assessment for Electronic Components Semiconductor Devices - Integrated Circuits - Sectional Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Qualification Approval ProceduresСогласованная система качественной оценки для устройств полупроводника электронных компонентов - интегральных схем - частная спецификация для пленочных интегральных схем и гибридных пленочных интегральных схем на основе процедур одобрения квалификации
Карточка документа - IEC 60748-22-1 Semiconductor Devices - Integrated Circuits - Part 22-1: Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures - Edition 2.0Полупроводниковые устройства - интегральные схемы - часть 22-1: пустая спецификация детали для пленочных интегральных схем и гибридных пленочных интегральных схем на основе процедур одобрения возможности - выпуск 2.0
Карточка документа - IEC 60748-21 Semiconductor Devices - Integrated Circuits - Part 21: Sectional Specification for Film Integrated Circuits and Hybrid Film Intergrated Circuits on the Basis of Qualification Approval Procedures - Edition 2.0; IECQ QC 760100Полупроводниковые устройства - интегральные схемы - часть 21: частная спецификация для пленочных интегральных схем и гибридного фильма межтерла схемы на основе процедур одобрения квалификации - выпуск 2.0; IECQ QC 760100
Карточка документа - IEC 60748-20-1 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Section 1: Requirements for Internal Visual Examination - Edition 1.0Полупроводниковые устройства - интегральные схемы - часть 20: универсальная спецификация для пленочных интегральных схем и гибридных пленочных интегральных схем - разделяет 1: требования для внутреннего визуального исследования - выпуск 1.0
Карточка документа - BSI BS QC 760000 Film and Hybrid Film Integrated Circuits. Generic Specification - AMD 6754: September 1991; AMD 9331: January 15, 1997Пленочные и гибридные пленочные интегральные схемы. Универсальная спецификация - AMD 6754: сентябрь 1991; AMD 9331: 15 января 1997
Карточка документа - IEC 60748-20 Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Edition 1.0; Includes Amendment 1: 9/1995Полупроводниковые устройства - интегральные схемы - часть 20: универсальная спецификация для пленочных интегральных схем и гибридных пленочных интегральных схем - выпуск 1.0; включает поправку 1: 9/1995
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