DIN EN 61191-1 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013)
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- 13
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- 13.160
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- DIN EN 61191-1 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013)
- CENELEC EN 61249-8-8 Materials for Interconnection Structures Part 8: Sectional Specification Set for Non-Conductive Films and Coatings Section 8: Temporary Polymer Coatings
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- Картотека зарубежных и международных стандартов
Ссылается на
- В списке элементов: 15
- IEC 61190-1-2 Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly - Edition 3.0Присоединяемые материалы для электронного блока – Часть 1-2: Требования для спаивания вставок для высококачественных межсоединений в блоке электроники - Выпуск 3.0
Карточка документа - IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated ReprintПрисоединяемые материалы для электронного блока – Часть 1-3: Требования для электронных припоев класса и текли и нетекли твердые припои для электронных приложений спаивания - Выпуск 2.1 Объединенная Перепечатка
Карточка документа - IEC TR 61340-5-2 CORR 1 CORRIGENDUM 1 Part 5-2: Protection of electronic devices from electrostatic phenomena – User guide - Edition 1.0Часть 5-2 CORRIGENDUM 1: Защита электронных устройств от электростатических явлений – Руководство пользователя - Издание 1.0
Карточка документа - CENELEC CLC/TR 61340-5-2 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guideЭлектростатика - Часть 5-2: Защита электронных устройств от электростатических явлений - Руководство пользователя
Карточка документа - CENELEC EN 61340-5-1 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirementsЭлектростатика - Часть 5-1: Защита электронных устройств от электростатических явлений - Общие требования
Карточка документа - IEC 61340-5-1 Electrostatics – Part 5-1: Protection of electronic devices from electrostatic phenomena – General requirements - Edition 1.0Электростатика – Часть 5-1: Защита электронных приборов от электростатических явлений – Общих требований - Издание 1.0
На основе IEC 61340-5-1 разработан ГОСТ Р 53734.5.1-2009 (MOD)ГОСТ Р 53734.5.1-2009 (MOD) - CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guideТехнология монтажа на поверхность - Часть 2: Транспортировка и условия хранения устройств монтажа на поверхность (SMD) - Руководство по приложениям
Карточка документа - IEC 61760-2 Surface mounting technology – Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide - Edition 2.0Технология монтажа на поверхность – Часть 2: Транспортировка и условия хранения устройств монтажа на поверхность (SMD) – Руководства по приложениям - Выпуск 2.0
Карточка документа - IEC 61190-1-1 Attachmant Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly - Edition 1.0Материалы Attachmant для электронного блока - часть 1-1: требования для спаивания потоков для высококачественных соединений в блоке электроники - выпуск 1.0
Карточка документа - CENELEC EN 61191-4 Printed Board Assemblies Part 4: Sectional Specification Requirements for Terminal Soldered AssembliesЧасть 4 блоков печатной платы: частные требования спецификации для терминальных спаянных блоков
Карточка документа - IEC 61191-3 Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies - Edition 1.0Блоки печатной платы - часть 3: частная спецификация - требования для монтирования через дыру спаянные блоки - выпуск 1.0
На основе IEC 61191-3 разработан ГОСТ Р МЭК 61191-3-2010 (IDT)ГОСТ Р МЭК 61191-3-2010 (IDT) - IEC 61188-1-1 Printed Boards and Printed Board Assemblies - Design and Use - Part 1-1: Generic Requirements - Flatness Considerations for Electronic Assemblies - Edition 1.0Печатные платы и блоки печатной платы - проект и использование - часть 1-1: универсальные требования - соображения плоскости для электронных блоков - выпуск 1.0
На основе IEC 61188-1-1 разработан ГОСТ IEC 61188-1-1-2013 (IDT)ГОСТ IEC 61188-1-1-2013 (IDT) - CENELEC EN 61249-8-8 Materials for Interconnection Structures Part 8: Sectional Specification Set for Non-Conductive Films and Coatings Section 8: Temporary Polymer CoatingsМатериалы для части 8 структур межсоединений: частный набор спецификации для непроводящего раздела фильмов и покрытий 8: временные полимерные покрытия
Карточка документа - IEC 61249-8-8 Materials for Interconnection Structures - Part 8: Sectional Specification Set for Non-Conductive Films and Coatings - Section 8: Temporary Polymer Coatings - Edition 1.0Материалы для структур межсоединений - часть 8: частный набор спецификации для непроводящих фильмов и покрытий - разделяет 8: временные полимерные покрытия - выпуск 1.0
Карточка документа - IEC 60721-3-1 Classification of Environmental Conditions - Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 1: Storage - Edition 2.0Классификация условий окружающей среды - часть 3: классификация групп экологических параметров и их строгого обращения - раздел 1: хранение - издание 2.0
На основе IEC 60721-3-1 разработан ГОСТ Р 51908-2002 (NEQ)ГОСТ Р 51908-2002 (NEQ)
