DIN EN 61191-1 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013)
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- 13
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- 13.160
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- DIN EN 60749-30 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011)
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- CENELEC EN 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
- DIN EN 61191-1 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013)
- CENELEC EN 61249-8-8 Materials for Interconnection Structures Part 8: Sectional Specification Set for Non-Conductive Films and Coatings Section 8: Temporary Polymer Coatings
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- Картотека зарубежных и международных стандартов
Deutsches Institut fur Normung e. V.
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013)
N EN 61191-1
Автоматический перевод:
Блоки печатной платы - Часть 1: Универсальная спецификация - Требования для спаянных электрических и электронных блоков с помощью монтажа на поверхность и связанной технологии сборки (61191-1:2013 IEC)
Эта часть Международной комиссии по электротехнике 61 191 устанавливает требования к материалам, процессам и критериям доказательства для изготовления запаянных подключений и блоков высокого качества посредством техник поверхностного монтажа и родственных техник монтажа. Эта часть Международной комиссии по электротехнике 61 191 содержит также рекомендации для хороших методов изготовления.
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