IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
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Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
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- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
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- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- Картотека зарубежных и международных стандартов
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- В списке элементов: 26
- DIN EN 61837-2 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014)Поверхность смонтировала пьезоэлектрические устройства для подстройки частоты и выбора - Стандартные основы и терминальные ведущие соединения - Часть 2: Керамические корпуса (IEC, 61837-2:2011 + A1:2014)
Карточка документа - DIN EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012)Механическая стандартизация полупроводниковых устройств - Часть 6-22: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Руководство по проектированию для полупроводникового Кремния пакетов Массив шариковых выводов С резьбой малого шага и Кремниевый Массив Сетки Земли С резьбой малого шага (S-FBGA и S-FLGA) (IEC 60191-6-22:2012)
Карточка документа - DIN EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 61240:2012)Пьезоэлектрические устройства - Подготовка контурных рисунков смонтированных поверхностью устройств (SMD) для подстройки частоты и выбора - Общие правила (IEC 61240:2012)
Карточка документа - CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)Механическая стандартизация полупроводниковых устройств - Часть 6-22: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Руководство по проектированию для полупроводникового Кремния пакетов Массив шариковых выводов С резьбой малого шага и Кремниевый Массив Сетки Земли С резьбой малого шага (S-FBGA и S-FLGA)
Карточка документа - BSI BS EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rulesПьезоэлектрические устройства - Подготовка контурных рисунков смонтированных поверхностью устройств (SMD) для управления частотой и выбора - Общие правила
Карточка документа - BSI BS EN 61837-1 Surface Mounted Piezoelectric Devices for Frequency Control and Selection - Standard Outlines and Terminal Lead Connections - Part 1: Plastic Moulded Enclosure OutlinesПоверхностные смонтированные пьезоэлектрические устройства для подстройки частоты и выбора - стандартные основы и терминал приводят соединения - часть 1: пластмассовые формируемые основы корпуса
Карточка документа - IEC 61240 Piezoelectric devices – Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection – General rules - Edition 2.0Пьезоэлектрические устройства – Подготовка контурных рисунков смонтированных поверхностью устройств (SMD) для управления частотой и выбора – Общих правил - Издание 2.0
Карточка документа - DIN EN 60191-6-12 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011)Механическая стандартизация полупроводниковых устройств - Часть 6-12: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Руководство по проектированию для массива сетки земли с резьбой малого шага (FLGA) (IEC 60191-6-12:2011)
Карточка документа - DIN EN 60191-6-17 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011)Механическая стандартизация полупроводниковых устройств - Часть 6-17: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Руководство по проектированию для сложенных пакетов - массив шариковых выводов С резьбой малого шага и массив сетки земли с резьбой малого шага (P-PFBGA и P-PFLGA) (IEC 60191-6-17:2011)
Карточка документа - BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014Поверхность смонтировала пьезоэлектрические устройства для подстройки частоты и выбора - Стандартные основы и терминальная ведущая Часть 2 соединений: Керамические корпуса - AMD: 31 августа 2014
Карточка документа - CENELEC EN 60191-6-17 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)Механическая стандартизация полупроводниковых устройств - Часть 6-17: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Руководство по проектированию для сложенных пакетов - массив шариковых выводов С резьбой малого шага и массив сетки земли с резьбой малого шага (P-PFBGA и P-PFLGA)
Карточка документа - DIN EN 60191-6-20 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010)Механическая стандартизация полупроводниковых устройств - Часть 6-20: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Измеряющиеся методы для размерностей пакета маленьких контурных J-выводных-корпусов (SOJ) (IEC 60191-6-20:2010)
Карточка документа - IEC 60191-6-17 Mechanical standardization of semiconductor devices – Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for stacked packages – Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) - Edition 1.0Механическая стандартизация полупроводниковых устройств – Часть 6-17: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства – Руководство по проектированию для сложенных пакетов – массива шариковых выводов С резьбой малого шага и массива сетки земли с резьбой малого шага (P-PFBGA и P-PFLGA) - Выпуск 1.0
Карточка документа - BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)Механическая стандартизация полупроводниковой Части 6-21 устройств: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Измеряющиеся методы для размерностей пакета малогабаритных корпусов (SOP)
Карточка документа - BSI BS EN 60191-6-20 Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)Механическая стандартизация полупроводниковой Части 6-20 устройств: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Измеряющиеся методы для размерностей пакета маленьких контурных J-выводных-корпусов (SOJ)
Карточка документа - IEC 60191-6-21 Mechanical standardization of semiconductor devices – Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline packages (SOP) - Edition 1.0Механическая стандартизация полупроводниковых устройств – Часть 6-21: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства – Измеряющиеся методы для размерностей пакета малогабаритных корпусов (SOP) - Выпуск 1.0
Карточка документа - IEC 60191-6-18 CORR 2 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA) CORRIGENDUM 2 - Edition 1.0MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES – Часть 6-18: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства – Руководство по проектированию для массива шариковых выводов (BGA) CORRIGENDUM 2 - Выпуск 1.0
Карточка документа - BSI BS EN 60191-6-18 Mechanical standardization of semiconductor devices Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) - CORR: October 31, 2010Механическая стандартизация полупроводниковой Части 6-18 устройств: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Руководство по проектированию для массива шариковых выводов (BGA) - CORR: 31 октября 2010
Карточка документа - CENELEC EN 60191-6-18 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)Механическая стандартизация полупроводниковых устройств - Часть 6-18: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Руководство по проектированию для массива шариковых выводов (BGA)
Карточка документа - BSI BS EN 60191-6-13 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)Механическая стандартизация полупроводниковых устройств - Часть 6-13: Руководство по проектированию типовых открытым верхом гнезд для Множества Сетки Шара С резьбой малого шага и Множества Сетки Земли С резьбой малого шага (FBGA/FLGA)
Карточка документа - BSI BS IEC 60191-1 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devicesМеханическая стандартизация полупроводниковых устройств - Часть 1: Общие правила для подготовки контурных рисунков дискретных устройств
Карточка документа - BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)Технология монтажа на поверхность - часть 1: стандартный метод для спецификации компонентов монтажа на поверхность (SMDs)
Карточка документа - BSI BS EN 60191-6-4 Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)Механическая стандартизация полупроводниковой Части 6-4 устройств: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые методы Измерения пакетов устройства для размерностей пакета массива шариковых выводов (BGA)
Карточка документа - BSI BS EN 60191-6-1 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminalsМеханическая стандартизация полупроводниковых устройств - Часть 6-1: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Руководство по проектированию для ведущих терминалов крыла типа "чайка"
Карточка документа - BSI BS EN 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Ball Grid Array (FBGA)Механическая стандартизация полупроводниковых устройств - часть 6-5: общие правила для подготовки контурных рисунков поверхностных смонтированных полупроводниковых пакетов устройства - руководство по проектированию для массива шариковых выводов с резьбой малого шага (FBGA)
Карточка документа - BSI BS EN 60191-6-3 Mechanical Standardization of Semiconductor Devices - Part 6-3: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Measuring Methods for Package Dimensions of Quad Flat Packs (QFP)Механическая стандартизация полупроводниковых устройств - часть 6-3: общие правила для подготовки контурных рисунков поверхностных смонтированных полупроводниковых пакетов устройства - измеряющиеся методы для размерностей пакета Квадратических плоских пакетов (QFP)
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