CENELEC EN 60191-6-18 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
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Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
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- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
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- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- Картотека зарубежных и международных стандартов
European Committee for Electrotechnical Standardization
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
N EN 60191-6-18
Annotation
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
Автоматический перевод:
Механическая стандартизация полупроводниковых устройств - Часть 6-18: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Руководство по проектированию для массива шариковых выводов (BGA)
Эта часть IEC 60191 предоставляет стандартные контурные рисунки, размерности и рекомендуемые изменения для всех квадратных пакетов массива шариковых выводов (BGA), терминальная подача которого составляет 1 мм или больше.
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