BSI BS EN 61188-5-8 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
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- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI PD IEC TR 60721-4-1 Classification of Environmental Conditions - Part 4-1: Guidance for the Correlation and Transformation of Environmental Condition Classes of IEC 60721-3 to the Environmental Tests of IEC 60068 - Storage - AMD 14597: October 10, 2003
- IEC 60068-2-13 Basic Environmental Testing Procedures Part 2: Tests Test M: Low Air Pressure - Edition 4.0
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- IEC 60068-2-13 Basic Environmental Testing Procedures Part 2: Tests Test M: Low Air Pressure - Edition 4.0
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 61760-3 Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
- IEC 60286-5 Packaging of components for automatic handling – Part 5: Matrix trays - Edition 2.1 Consolidated Reprint
- BSI BS EN 62090 Product package labels for electronic components using bar code and two-dimensional symbologies
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- Картотека зарубежных и международных стандартов
Ссылается на
- В списке элементов: 9
- BSI BS EN 60068-2-58 Environmental testing Part 2-58: Tests Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)Часть 2-58 испытаний на воздействия окружающих условий: Тесты Td: Методы тестирования для паяемости, сопротивления роспуску металлизации и спаиванию тепла устройств монтажа на поверхность (SMD)
Карточка документа - IEC 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 4.0Испытания на воздействия окружающих условий - Часть 2-58: Тесты - Тест Td: Методы тестирования для паяемости, сопротивления роспуску металлизации и спаиванию тепла устройств монтажа на поверхность (SMD) - Выпуск 4.0
Карточка документа - BSI BS EN 61191-1 Printed Board Assemblies - Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly TechnologiesБлоки печатной платы - часть 1: универсальная спецификация - требования для спаянных электрических и электронных блоков Используя монтаж на поверхность и связанную технологию сборки
Карточка документа - IEC 61191-1 Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies - Edition 2.0Блоки печатной платы – Часть 1: Универсальная спецификация – Требования для спаянных электрических и электронных блоков с помощью монтажа на поверхность и связанной технологии сборки - Выпуск 2.0
Карточка документа - IEC 60191-2 AMD 19 AMENDMENT 19 Mechanical standardization of semiconductor devices – Part 2: Dimensions - Edition 1.0Стандартизация Механического устройства AMENDMENT 19 полупроводниковых устройств – Часть 2: Размерности - Выпуск 1.0
Карточка документа - BSI BS EN 62090 Product package labels for electronic components using bar code and two-dimensional symbologiesПакет продуктов маркирует для электронных компонентов с помощью штрихкода и двумерных символических обозначений
Карточка документа - BSI BS EN 61188-5-1 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirementsПечатные платы и блоки печатной платы - Проект и использование - Часть 5-1: Присоединение (земля/соединение) соображения - Универсальные требования
Карточка документа - IEC 62090 Product package labels for electronic components using bar code and two-dimensional symbologies - Edition 1.0Этикетки для упаковки продуктов, электронных компонентов, используя штрих-коды и двухмерные символики - Edition 1.0
Карточка документа - IEC 61188-5-1 Printed Boards and Printed Board Assemblies - Design and Use - Part 5-1: Attachment (Land/Joint) Considerations - Generic Requirements - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987Печатные платы и блоки Печатной платы - Проект и Использование - Часть 5-1: Присоединение (Земля/Соединение) Соображения - Универсальные Требования - Выпуск 1.0; Замены Эд IEC 60321. 1.0: 1970 и IEC 60321-2 Эда. 1.0: 1987
На основе IEC 61188-5-1 разработан ГОСТ Р МЭК 61188-5-1-2012 (IDT)ГОСТ Р МЭК 61188-5-1-2012 (IDT)
