BSI BS EN 61188-5-8 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
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- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI PD IEC TR 60721-4-1 Classification of Environmental Conditions - Part 4-1: Guidance for the Correlation and Transformation of Environmental Condition Classes of IEC 60721-3 to the Environmental Tests of IEC 60068 - Storage - AMD 14597: October 10, 2003
- IEC 60068-2-13 Basic Environmental Testing Procedures Part 2: Tests Test M: Low Air Pressure - Edition 4.0
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- IEC 60068-2-13 Basic Environmental Testing Procedures Part 2: Tests Test M: Low Air Pressure - Edition 4.0
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 62137-4 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- IEC 60749-20 Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Edition 2.0
- CENELEC EN 61760-3 Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
- IEC 60286-5 Packaging of components for automatic handling – Part 5: Matrix trays - Edition 2.1 Consolidated Reprint
- BSI BS EN 62090 Product package labels for electronic components using bar code and two-dimensional symbologies
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- Картотека зарубежных и международных стандартов
British Standards Institution
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
N BS EN 61188-5-8
Автоматический перевод:
Печатные платы и блоки печатной платы - Проект и использование - Часть 5-8: Присоединение (земля/соединение) соображения - компоненты массива области (BGA, FBGA, CGA, LGA)
Эквиваленты данного стандарта:
- IEC 61188-5-8 Printed board and printed board assemblies – Design and use – Part 5-8: Attachment (land/joint) considerations – Area array components (BGA, FBGA, CGA, LGA) - Edition 1.0
- CENELEC EN 61188-5-8 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
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