BSI BS EN 62047-16 Semiconductor devices — Micro-electromechanical devices Part 16: Test methods for determining residual stresses of MEMS films — Wafer curvature and cantilever beam deflection methods
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
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- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- DIN EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014)
- ASTM E132 Standard Test Method for Poisson’s Ratio at Room Temperature
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- Картотека зарубежных и международных стандартов
British Standards Institution
Semiconductor devices — Micro-electromechanical devices Part 16: Test methods for determining residual stresses of MEMS films — Wafer curvature and cantilever beam deflection methods
N BS EN 62047-16
Автоматический перевод:
Полупроводниковые устройства — Микроэлектромеханическая Часть 16 устройств: Методы тестирования для определения остаточного напряжения фильмов MEMS — Слоистое искривление и консоль излучают методы отклонения
Эквиваленты данного стандарта:
- CENELEC EN 62047-16 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
- IEC 62047-16 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods - Edition 1.0
- DS DS/EN 62047-16 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
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