BSI BS EN 61192-3 Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General - Edition 1.0
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
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- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General - Edition 1.0
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General - Edition 1.0
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General - Edition 1.0
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General - Edition 1.0
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General - Edition 1.0
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General - Edition 1.0
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General - Edition 1.0
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General - Edition 1.0
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 62137-1-3 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test - Edition 1.0
- IEC 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General - Edition 1.0
- IEC 61192-1 Workmanship requirements for soldered electronic assemblies Part 1: General - Edition 1.0
- BSI BS EN 61193-1 Quality Assessment Systems - Part 1: Registration and Analysis of Defects on Printed Board Assemblies - CORR 13939: May 14, 2002
- BSI BS EN 61192-5 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
- BSI BS EN 61192-3 Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies
- IEC 61192-2 Workmanship requirements for soldered electronic assemblies Part 2: Surface-mount assemblies - Edition 1.0
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- Картотека зарубежных и международных стандартов
Ссылается на
- В списке элементов: 6
- BSI BS EN 61191-1 Printed Board Assemblies - Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly TechnologiesБлоки печатной платы - часть 1: универсальная спецификация - требования для спаянных электрических и электронных блоков Используя монтаж на поверхность и связанную технологию сборки
Карточка документа - BSI BS EN 61192-4 Workmanship requirements for soldered electronic assemblies Part 4: Terminal assembliesТребования мастерства для спаянной электронной Части 4 блоков: Терминальные блоки
Карточка документа - IEC 61192-2 Workmanship requirements for soldered electronic assemblies Part 2: Surface-mount assemblies - Edition 1.0Требования мастерства для спаянной электронной Части 2 блоков: блоки монтажа на поверхность - Выпуск 1.0
На основе IEC 61192-2 разработан ГОСТ Р МЭК 61192-2-2010 (IDT)ГОСТ Р МЭК 61192-2-2010 (IDT) - BSI BS EN 61191-4 Printed Board Assemblies - Part 4: Sectional Specification - Requirements for Terminal Soldered AssembliesБлоки печатной платы - часть 4: частная спецификация - требования для терминальных спаянных блоков
Карточка документа - BSI BS EN 61191-3 Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered AssembliesБлоки печатной платы - часть 3: частная спецификация - требования для монтирования через дыру спаянные блоки
Карточка документа - IEC 61191-3 Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies - Edition 1.0Блоки печатной платы - часть 3: частная спецификация - требования для монтирования через дыру спаянные блоки - выпуск 1.0
На основе IEC 61191-3 разработан ГОСТ Р МЭК 61191-3-2010 (IDT)ГОСТ Р МЭК 61191-3-2010 (IDT)
