ASTM E1237 Standard Guide for Installing Bonded Resistance Strain Gages
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Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
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- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- 31.080
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- 31.080.99
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- ASTM E132 Standard Test Method for Poisson’s Ratio at Room Temperature
- ASTM E1012 Standard Practice for Verification of Testing Frame and Specimen Alignment Under Tensile and Compressive Axial Force Application
- ASTM E1237 Standard Guide for Installing Bonded Resistance Strain Gages
- ASTM E1949 Standard Test Method for Ambient Temperature Fatigue Life of Metallic Bonded Resistance Strain Gages
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- Картотека зарубежных и международных стандартов
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- В списке элементов: 3
- ASTM E1012 Standard Practice for Verification of Testing Frame and Specimen Alignment Under Tensile and Compressive Axial Force ApplicationОбщепринятая практика для проверки тестирования рамы и выравнивания экземпляра под растяжимым и сжимающим осевым применением силы
Карточка документа - ASTM E1949 Standard Test Method for Ambient Temperature Fatigue Life of Metallic Bonded Resistance Strain GagesСтандартный метод испытаний для жизни усталости температуры окружающей среды металлических связанных тензодатчиков сопротивления
Карточка документа - ASTM E251 Standard Test Methods for Performance Characteristics of Metallic Bonded Resistance Strain GagesСтандартные методы испытаний для технических характеристик металлических связанных тензодатчиков сопротивления
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