ASTM E1237 Standard Guide for Installing Bonded Resistance Strain Gages
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- 31
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- 31.080
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- 31.080.99
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- ASTM E132 Standard Test Method for Poisson’s Ratio at Room Temperature
- ASTM E1012 Standard Practice for Verification of Testing Frame and Specimen Alignment Under Tensile and Compressive Axial Force Application
- ASTM E1237 Standard Guide for Installing Bonded Resistance Strain Gages
- ASTM E1949 Standard Test Method for Ambient Temperature Fatigue Life of Metallic Bonded Resistance Strain Gages
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- Картотека зарубежных и международных стандартов
ASTM International
Standard Guide for Installing Bonded Resistance Strain Gages
N E1237
Annotation
This guide provides guidelines for installing bonded resistance strain gages. It is not intended to be used for bulk or diffused semiconductor gages. This document pertains only to adhesively bonded strain gages.
The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Автоматический перевод:
Типичный гид для установки связанных тензодатчиков сопротивления
Этот гид обеспечивает инструкции для установки связанных тензодатчиков сопротивления. Это не предназначено, чтобы использоваться для большой части или рассеяло полупроводниковые сортаменты. Этот документ принадлежит только адгезивно тензометрам, жестко скрепленным с поверхностью исследуемого объекта.



