SAE AS6171/3 Techniques for Suspect/Counterfeit EEE Parts Detection by X-ray Fluorescence Test Methods
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- SAE AS6171/2 Techniques for Suspect/Counterfeit EEE Parts Detection by External Visual Inspection, Remarking and Resurfacing, and Surface Texture Analysis Test Methods
- ASTM D1039 Standard Test Methods for Glass-Bonded Mica Used as Electrical Insulation
- ASTM D2149 Standard Test Method for Permittivity (Dielectric Constant) And Dissipation Factor Of Solid Dielectrics At Frequencies To 10 MHz And Temperatures To 500°C
- ASTM D2442 Standard Specification for Alumina Ceramics for Electrical and Electronic Applications
- ASTM D2149 Standard Test Method for Permittivity (Dielectric Constant) And Dissipation Factor Of Solid Dielectrics At Frequencies To 10 MHz And Temperatures To 500°C
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- ASTM D1039 Standard Test Methods for Glass-Bonded Mica Used as Electrical Insulation
- ASTM D2149 Standard Test Method for Permittivity (Dielectric Constant) And Dissipation Factor Of Solid Dielectrics At Frequencies To 10 MHz And Temperatures To 500°C
- ASTM D2442 Standard Specification for Alumina Ceramics for Electrical and Electronic Applications
- ASTM D2149 Standard Test Method for Permittivity (Dielectric Constant) And Dissipation Factor Of Solid Dielectrics At Frequencies To 10 MHz And Temperatures To 500°C
- 29.035
- ASTM D1039 Standard Test Methods for Glass-Bonded Mica Used as Electrical Insulation
- ASTM D2149 Standard Test Method for Permittivity (Dielectric Constant) And Dissipation Factor Of Solid Dielectrics At Frequencies To 10 MHz And Temperatures To 500°C
- ASTM D2442 Standard Specification for Alumina Ceramics for Electrical and Electronic Applications
- ASTM D2149 Standard Test Method for Permittivity (Dielectric Constant) And Dissipation Factor Of Solid Dielectrics At Frequencies To 10 MHz And Temperatures To 500°C
- ASTM D1039 Standard Test Methods for Glass-Bonded Mica Used as Electrical Insulation
- ASTM D1039 Standard Test Methods for Glass-Bonded Mica Used as Electrical Insulation
- ASTM D2149 Standard Test Method for Permittivity (Dielectric Constant) And Dissipation Factor Of Solid Dielectrics At Frequencies To 10 MHz And Temperatures To 500°C
- ASTM D2442 Standard Specification for Alumina Ceramics for Electrical and Electronic Applications
- ASTM D2442 Standard Specification for Alumina Ceramics for Electrical and Electronic Applications
- DLA MIL-STD-883K CHANGE 1 TEST METHOD STANDARD MICROCIRCUITS
- SAE AS6171/5 Techniques for Suspect/Counterfeit EEE Parts Detection by Radiological Test Methods
- SAE AS6171/4 Techniques for Suspect/Counterfeit EEE Parts Detection by Delid/Decapsulation Physical Analysis Test Methods
- SAE AS6171/11 Techniques for Suspect/Counterfeit EEE Parts Detection by Design Recovery Test Methods
- SAE AS6171 Test Methods Standard; General Requirements, Suspect/Counterfeit, Electrical, Electronic, and Electromechanical Parts
- Картотека зарубежных и международных стандартов
SAE International
Techniques for Suspect/Counterfeit EEE Parts Detection by X-ray Fluorescence Test Methods
N AS6171/3
Annotation
XRF technique for counterfeit detection is applicable to electrical, electronic and electromechanical (EEE) parts as listed in AS6171 General Requirements. In general, the detection technique is meant for use on piece parts prior to assembly on a circuit board or on the parts that are removed from a circuit board. The applicability spans a large swath of active, passive and electromechanical parts.
If AS6171/3 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
Purpose
The purpose of this document is to provide information and instructions on how to use XRF as a technique to verify the materials and finishes of EEE parts to compare with the original design, construction and material requirements. The process of detection is based on identification of elements (or absence thereof) in a component. The indication of counterfeit risk can also be based on the presence of and concentration levels of materials under consideration. The counterfeit detection process using XRF can be applied to components as received or on delidded, decapsulated, or otherwise prepared parts. For reliable decision making, findings from XRF analysis need to be compared with material composition information of appropriate exemplars, compared with each other in the lot, or compared with the original manufacturer's documented specifications.
Автоматический перевод:
Методы для Подозреваемого/Подделки Обнаружение Частей EEE Методами испытаний Флюоресценции рентгена
