CENELEC EN 60749-38 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC EN 60749-21 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
- 31
- CENELEC EN 60749-21 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
- 31.080
- CENELEC EN 60749-21 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
- 31.080.01
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- IEC 60747-5-6 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes - Edition 1.0
- IEC 60749-38 Semiconductor devices – Mechanical and climatic test methods – Part 38: Soft error test method for semiconductor devices with memory - Edition 1.0
- BSI BS EN 60749-44 Semiconductor devices — Mechanical and climatic test methods Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- Картотека зарубежных и международных стандартов
European Committee for Electrotechnical Standardization
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
N EN 60749-38
Автоматический перевод:
Полупроводниковые устройства - Механические и климатические методы тестирования - Часть 38: метод тестирования Исправимой ошибки для полупроводниковых устройств с памятью
Эквиваленты данного стандарта:
- BSI BS EN 60749-38 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
- IEC 60749-38 Semiconductor devices – Mechanical and climatic test methods – Part 38: Soft error test method for semiconductor devices with memory - Edition 1.0
Уважаемый пользователь!
Обратитесь к обслуживающему Вас представителю за дополнительной информацией о возможности приобретения документов указанного разработчика и заказа перевода.
