CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
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- CENELEC EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- 31.080
- CENELEC EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- 31.080.99
- CENELEC EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- CENELEC EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- CENELEC EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- DIN EN 62047-3 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006)
- DIN EN 62047-22 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014)
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- DIN EN 62047-22 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014)
- DIN EN 62047-22 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014)
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- Картотека зарубежных и международных стандартов
На него ссылаются
- В списке элементов: 6
- BSI BS EN 62047-22 Semiconductor devices — Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substratesПолупроводниковые элементы. Конструктивные элементы микро-техники системы. Электромеханический метод испытания поезда для проводящих тонких слоев на гибких субстратах
Карточка документа - CENELEC EN 62047-22 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substratesПолупроводниковые устройства - Микроэлектромеханические устройства - Часть 22: Электромеханический метод испытания на растяжение для проводящих тонких пленок на гибких подложках
Карточка документа - BSI BS EN 62047-11 Semiconductor devices — Micro-electromechanical devices Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systemsПолупроводниковые устройства — Микроэлектромеханическая Часть 11 устройств: Метод тестирования для коэффициентов линейного теплового расширения автономных материалов для микроэлектромеханических систем
Карточка документа - CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systemsПолупроводниковые устройства - Микроэлектромеханические устройства - Часть 11: Метод тестирования для коэффициентов линейного теплового расширения автономных материалов для микроэлектромеханических систем
Карточка документа - DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)Полупроводниковые устройства - Микроэлектромеханические устройства - Часть 12: Изгиб метода испытания на усталость тонкопленочных материалов с помощью резонирующей вибрации структур MEMS (62047-12:2011 IEC)
Карточка документа - DIN EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011)Полупроводниковые устройства - Микроэлектромеханические устройства - Часть 8: Полоса, изгибающая метод тестирования для растяжимого измерения свойства тонких пленок (62047-8:2011 IEC)
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