BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- BSI BS EN 953 + A1 Safety of machinery - Guards - General requirements for the design and construction of fixed and movable guards - AMD: April 30, 2009
- BSI BS EN 1012-1 Compressors and vacuum pumps - Safety requirements Part 1: Air compressors
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN 1012-1 Compressors and vacuum pumps - Safety requirements Part 1: Air compressors
- BSI BS EN 1012-1 Compressors and vacuum pumps - Safety requirements Part 1: Air compressors
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN ISO 14122-3 + A1 Safety of machinery - Permanent means of access to machinery - Part 3: Stairways, stepladders and guard-rails - AMD: August 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN 1846-2 + A1 Firefighting and rescue service vehicles Part 2: Common requirements - Safety and performance - CORR: November 30, 2010; AMD: August 31, 2013
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- BSI BS EN 60204-1 + A1 Safety of machinery. Electrical equipment of machines. Part 1: General requirements - AMD: April 30, 2009; CORR: May 31, 2010
- BSI BS EN ISO 13849-1 Safety of machinery - Safety-related parts of control systems Part 1: General principles for design - CORR: August 31, 2010
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60447 Basic and safety principles for man-machine interface, marking and identification Actuating principles - Edition 3.0
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- IEC 60749-40 Semiconductor devices – Mechanical and climatic test methods – Part 40: Board level drop test method using a strain gauge - Edition 1.0
- IEC 60749-37 Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer - Edition 1.0
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 953 + A1 Safety of machinery - Guards - General requirements for the design and construction of fixed and movable guards - AMD: April 30, 2009
- Картотека зарубежных и международных стандартов
British Standards Institution
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
N BS EN 60749-37
Автоматический перевод:
Полупроводниковые устройства - Механические и климатические методы тестирования - Часть 37: метод испытания на падение На уровне плат с помощью акселерометра
Эквиваленты данного стандарта:
- IEC 60749-37 Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer - Edition 1.0
- CENELEC EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
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