BSI BS EN 60749-10 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock - CORR 14112: September 17, 2002
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC EN 60749-21 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
- 31
- CENELEC EN 60749-21 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
- 31.080
- CENELEC EN 60749-21 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
- 31.080.01
- CENELEC EN 60749-21 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- IEC 60747-5-6 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes - Edition 1.0
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- IEC 60747-5-6 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes - Edition 1.0
- IEC 60747-5-6 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes - Edition 1.0
- IEC 60749-40 Semiconductor devices – Mechanical and climatic test methods – Part 40: Board level drop test method using a strain gauge - Edition 1.0
- IEC 60749-37 Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer - Edition 1.0
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- Картотека зарубежных и международных стандартов
Ссылается на
- В списке элементов: 2
- BSI BS EN 60068-2-27 Environmental testing - Part 2-27: Tests - Test Ea and guidance: ShockОкружающее влияние. Методы испытания. Проверка Ea и руководство. Шокировать
Карточка документа - IEC 60068-2-27 Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock - Edition 4.0Испытания на воздействия окружающих условий – Часть 2-27: Тесты – Испытательная Земля и руководство: Шок - Издание 4.0
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