CENELEC EN 61189-5-2 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
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Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-69 Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-69 Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19.040
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-69 Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-69 Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 29.020
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-69 Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-69 Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-69 Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-69 Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - Edition 2.0
- IEC 60068-2-69 Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - Edition 2.0
- CEI EN 60068-2-83 Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
- IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- Картотека зарубежных и международных стандартов
Ссылается на
- В списке элементов: 22
- IEC 61189-5-3 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-3: General test methods for materials and assemblies – Soldering paste for printed board assemblies - Edition 1.0Методы тестирования для электрических материалов, печатных плат и других структур межсоединений и блоков – Часть 5-3: Общие методы тестирования для материалов и блоков – Спаивающий вставку для блоков печатной платы - Выпуск 1.0
Карточка документа - IEC 61189-5-2 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies - Edition 1.0Методы тестирования для электрических материалов, печатных плат и других структур межсоединений и блоков - Часть 5-2: Общие методы тестирования для материалов и блоков - Спаивающий поток для блоков печатной платы - Выпуск 1.0
Карточка документа - IEC 62137-4 Electronics assembly technology – Part 4: Endurance test methods for solder joint of area array type package surface mount devices - Edition 1.0Технология сборки электроники – Часть 4: методы В виде испытания на выносливость для паяного соединения планарно монтируемый компонентов пакета типа массива области - Выпуск 1.0
Карточка документа - IEC 60068-1 Environmental Testing Part 1: General and Guidance - Edition 7.0Часть 1 испытаний на воздействия окружающих условий: общий и руководство - издание 7.0
Карточка документа - ISO 9455-16 Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method - Second EditionПотоки низкотемпературной пайки - Методы испытаний - Часть 16: тест на эффективность Потока, смачивая балансовый метод - Второй Выпуск
Карточка документа - ISO 9455-10 Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method - Second EditionПотоки низкотемпературной пайки - Методы испытаний - Часть 10: тест на эффективность Потока, спаяйте метод распространения - Второй Выпуск
Карточка документа - IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated ReprintПрисоединяемые материалы для электронного блока – Часть 1-3: Требования для электронных припоев класса и текли и нетекли твердые припои для электронных приложений спаивания - Выпуск 2.1 Объединенная Перепечатка
Карточка документа - IEC 60068-2-20 Environmental testing – Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads - Edition 5.0Испытания на воздействия окружающих условий – Часть 2-20: Тесты – Тест T: Методы испытаний для паяемости и сопротивления спаиванию тепла устройств с ведут - Издание 5.0
На основе IEC 60068-2-20 разработан ГОСТ Р МЭК 60068-2-20-2015 (IDT)ГОСТ Р МЭК 60068-2-20-2015 (IDT) - ISO 9455-17 Soft soldering fluxes Test methods Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues - First EditionНизкотемпературная пайка течет Часть 17 Методов испытаний: тест гребенки Поверхностного сопротивления изоляции и электрохимический тест на миграцию остатков потока - Первый Выпуск
Карточка документа - IEC 61249-2-7 Materials for Printed Boards and Other Interconnecting Structures - Part 2-7: Reinforced Base Materials Clad and Unclad - Epoxide Woven E-Glass Laminated Sheet of Defined Flammability (Vertical Burning Test), Copper-Clad - Edition 1.0; Replaces IEC 60249 SeriesМатериалы для Печатных плат и Других Взаимосвязанных Структур - Часть 2-7: Усиленные Основные материалы, Одетые и Голые - Эпоксид Сотканное электронное Стекло Слоистый Лист Определенной Воспламеняемости (Вертикальный Горящий Тест), Медно-одетый - Выпуск 1.0; ряд IEC 60249 Замен
На основе IEC 61249-2-7 разработан ГОСТ Р МЭК 61249-2-7-2012 (IDT)ГОСТ Р МЭК 61249-2-7-2012 (IDT) - ISO 9455-13 Soft Soldering Fluxes - Test Methods - Part 13: Determination of Flux Spattering - First EditionПотоки низкотемпературной пайки - методы испытаний - часть 13: определение разбрызгивания потока - первый выпуск
Карточка документа - ISO 9455-15 Soft Soldering Fluxes - Test Methods - Part 15: Copper Corrosion Test First EditionПотоки низкотемпературной пайки - методы испытаний - часть 15: медное испытание на коррозийную стойкость первый выпуск
Карточка документа - ISO 9455-6 Soft Soldering Fluxes - Test Methods - Part 6: Determination and Detection of Halide (Excluding Fluoride) Content First EditionПотоки низкотемпературной пайки - методы испытаний - часть 6: определение и обнаружение галида (исключая фторид) содержание первый выпуск
Карточка документа - ISO 5725-2 Accuracy (Trueness and Precision) of Measurement Methods and Results - Part 2: Basic Method for the Determination of Repeatability and Reproducibility of a Standard Measurement Method First Edition; - Technical Corrigendum 1: 5/15/2002Точность (Верность и точность) измерительных методов и результатов - часть 2: основной метод для определения воспроизводимости и воспроизводимости стандартного измерительного метода первый выпуск; - техническое исправление 1: 15.05.2002
На основе ISO 5725-2 разработан ГОСТ Р ИСО 5725-2-2002 (IDT)ГОСТ Р ИСО 5725-2-2002 (IDT) - ISO 9455-9 Soft Soldering Fluxes - Test Methods - Part 9: Determination of Ammonia Content First Edition (CEN EN ISO 9455-9: 1995)Потоки низкотемпературной пайки - методы испытаний - часть 9: определение содержания аммиака первый выпуск (CEN EN ISO 9455-9: 1995)
Карточка документа - ISO 9455-2 Soft Soldering Fluxes - Test Methods - Part 2: Determination of Non-Volatile Matter, Ebulliometric Method First Edition (CEN EN ISO 9455-2: 1995)Потоки низкотемпературной пайки - методы испытаний - часть 2: определение нелетучее вещества, метод Ebulliometric первый выпуск (CEN EN ISO 9455-2: 1995)
Карточка документа - ISO 9455-5 Soft Soldering Fluxes - Test Methods - Part 5: Copper Mirror Test First Edition (CEN EN 29455-5: 1993)Мягкие потоки спаивания - методы испытаний - часть 5: медный тест зеркала первый выпуск (ЦЭНЬ ЭНЬ 29455-5: 1993)
Карточка документа - ISO 9455-3 Soft Soldering Fluxes - Test Methods - Part 3: Determination of Acid Value, Potentiometric and Visual Titration Methods First Edition; (CEN EN ISO 9455-3: 1994)Потоки низкотемпературной пайки - методы испытаний - часть 3: определение показателя кислотности, потенциометрические и визуальные методы титрования первый выпуск; (CEN EN ISO 9455-3: 1994)
Карточка документа - ISO 9455-11 Soft Soldering Fluxes - Test Methods - Part 11: Solubility of Flux Residues First Edition (CEN EN 29455-11: 1993)Потоки низкотемпературной пайки - методы испытаний - часть 11: растворимость остатков потока первый выпуск (CEN EN 29455-11: 1993)
Карточка документа - ISO 9455-14 Soft Soldering Fluxes - Test Methods - Part 14: Assessment of Tackiness of Flux Residues First Edition (CEN EN 29455-14: 1993)Потоки низкотемпературной пайки - методы испытаний - часть 14: оценка липкости остатков потока первый выпуск (CEN EN 29455-14: 1993)
Карточка документа - ISO 9455-8 Soft Soldering Fluxes - Test Methods - Part 8: Determination of Zinc Content First Edition (CEN EN 29455-8: 1993)Потоки низкотемпературной пайки - методы испытаний - часть 8: определение содержания цинка первый выпуск (CEN EN 29455-8: 1993)
Карточка документа - ISO 9455-1 Soft Soldering Fluxes - Test Methods - Part 1: Determination of Non- Volatile Matter, Gravimetric Method First Edition (CEN EN 29455-1: 1993)Потоки низкотемпературной пайки - методы испытаний - часть 1: определение не - летучее вещество, гравиметрический метод первый выпуск (CEN EN 29455-1: 1993)
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