CEI EN 60068-2-83 Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
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Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19.040
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 29.020
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
- IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated Reprint
- CEI EN 60068-2-83 Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
- IEC 60068-2-69 Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - Edition 2.0
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- Картотека зарубежных и международных стандартов
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- В списке элементов: 5
- IEC 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 4.0Испытания на воздействия окружающих условий - Часть 2-58: Тесты - Тест Td: Методы тестирования для паяемости, сопротивления роспуску металлизации и спаиванию тепла устройств монтажа на поверхность (SMD) - Выпуск 4.0
Карточка документа - IEC 60068-1 Environmental Testing Part 1: General and Guidance - Edition 7.0Часть 1 испытаний на воздействия окружающих условий: общий и руководство - издание 7.0
Карточка документа - IEC 61190-1-3 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications - Edition 2.1 Consolidated ReprintПрисоединяемые материалы для электронного блока – Часть 1-3: Требования для электронных припоев класса и текли и нетекли твердые припои для электронных приложений спаивания - Выпуск 2.1 Объединенная Перепечатка
Карточка документа - IEC 60068-2-20 Environmental testing – Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads - Edition 5.0Испытания на воздействия окружающих условий – Часть 2-20: Тесты – Тест T: Методы испытаний для паяемости и сопротивления спаиванию тепла устройств с ведут - Издание 5.0
На основе IEC 60068-2-20 разработан ГОСТ Р МЭК 60068-2-20-2015 (IDT)ГОСТ Р МЭК 60068-2-20-2015 (IDT) - IEC 60068-2-69 Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - Edition 2.0Экологическое испытание – Часть 2-69: Испытания – Испытание Те: испытание Паяемости электронных компонентов для устройств монтажа поверхности (SMD) балансовым методом смачивания - Издание 2.0
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