DNVGL DNVGL-RP-0496 Cyber security resilience management for ships and mobile offshore units in operation
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Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19.040
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 29.020
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- IEC 61069-5 Industrial-process measurement, control and automation – Evaluation of system properties for the purpose of system assessment – Part 5: Assessment of system dependability - Edition 2.0
- IEC 62443-2-4 CORR 1 Security for industrial automation and control systems – Part 2-4: Security program requirements for IACS service providers - Edition 1.0
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- Картотека зарубежных и международных стандартов
Ссылается на
- В списке элементов: 12
- ISO ISO/IEC 27000 Information technology - Security techniques - Information security management systems - Overview and vocabulary - Fourth EditionИнформационные технологии - методы Безопасности - системы управления Информационной безопасностью - Обзор и словарь - Четвертый Выпуск
Карточка документа - ISO ISO/IEC 27001 CORR 2 Information technology - Security techniques - Information security management systems - Requirements TECHNICAL CORRIGENDUM 2 - Second EditionИнформационные технологии - методы безопасности - системы управления Информационной безопасностью - требования TECHNICAL CORRIGENDUM 2 - Второй Выпуск
Карточка документа - ISO ISO/IEC 27002 CORR 2 Information technology - Security techniques - Code of practice for information security controls TECHNICAL CORRIGENDUM 2 - Second EditionИнформационные технологии - методы Безопасности - Свод правил для управления защитой информации ТЕХНИЧЕСКОЕ ИСПРАВЛЕНИЕ 2 - Второй Выпуск
Карточка документа - IEC 62443-2-4 CORR 1 Security for industrial automation and control systems – Part 2-4: Security program requirements for IACS service providers - Edition 1.0Безопасность для автоматизации производства и систем управления – Часть 2-4: требования Программы обеспечения безопасности для поставщиков услуг IACS - Выпуск 1.0
Карточка документа - IEC 61162-460 Maritime navigation and radiocommunication equipment and systems – Digital interfaces – Part 460: Multiple talkers and multiple listeners – Ethernet interconnection – Safety and security - Edition 1.0Морская навигация и оборудование радиосвязи и системы – Цифровые интерфейсы – Часть 460: Многократные говорящие и многократные слушатели – соединение Ethernet – Безопасность - Издание 1.0
Карточка документа - DNV GL OS-D203 Integrated Software Dependent Systems (ISDS)Интегрированные программно-зависимые системы (ISDS)
Карточка документа - IEC 62443-3-3 CORR 1 Industrial communication networks – Network and system security Part 3-3: System security requirements and security levels - Edition 1.0Промышленные сети связи – Сеть и Часть 3-3 безопасности системы: требования безопасности системы и уровни безопасности - Выпуск 1.0
Карточка документа - ISO ISO/IEC 27005 Information technology - Security techniques - Information security risk management - Second EditionИнформационные технологии - методы Безопасности - управление рисками Информационной безопасности - Второй Выпуск
Карточка документа - IEC TR 62443-3-1 Industrial communication networks – Network and system security – Part 3-1: Security technologies for industrial automation and control systems - Edition 1.0Промышленные сети связи – Сеть и безопасность системы – Часть 3-1: Технологии безопасности для автоматизации производства и систем управления - Выпуск 1.0
Карточка документа - BSI BS 4N 100-4 Aircraft oxygen systems and equipment - Part 4: Guide to the physiological factors - AMD 14191: February 18, 2003Кислородные системы самолета и оборудование - Часть 4: Справочник по физиологическим факторам - AMD 14191: 18 февраля 2003
Карточка документа - BSI BS 4N 100-1 Aircraft oxygen systems and equipment - Part 1: Design and installation - AMD 15951: October 2005; AMD 17217: July 31, 2007Кислородные системы самолета и оборудование - Часть 1: Дизайн и установка - AMD 15951: октябрь 2005; AMD 17217: 31 июля 2007
Карточка документа - BSI BS 4N 100-3 Aircraft oxygen systems and equipment - Part 3: Testing of equipment and systems - AMD 14906: March 1, 2004Кислородные системы самолета и оборудование - Часть 3: Тестирование оборудования и систем - AMD 14906: 1 марта 2004
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