IEC 61189-3-719 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3-719: Test methods for interconnection structures (printed boards) – Monitoring of single plated-through hole (PTH) resistance change during temperature cycling - Edition 1.0
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Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19.040
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 29.020
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC 60068-3-8 Environmental testing Part 3-8: Supporting documentation and guidance Selecting amongst vibration tests - Edition 1.0
- CEI EN 60068-2-57 Environmental testing Part 2-57: Tests - Test Ff: Vibration - Time-history and sine-beat method
- CEI EN 60068-1 Environmental testing Part 1: General and guidance
- IEC 62326-20 Printed boards – Part 20: Printed circuit boards for high-brightness LEDs - Edition 1.0
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- Картотека зарубежных и международных стандартов
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- CENELEC EN 62326-20 Printed boards - Part 20: Printed circuit boards for highbrightness LEDsПечатные правления - Часть 20: Печатные платы для highbrightness LEDs
Карточка документа - CEI EN 61189-5-4 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assembliesМетоды испытаний для электрических материалов, распечатанных досок и другой соединительной Части 5-4 структур и сборок: Общие методы испытаний для материалов и сборок - Припои и текли и нетекли одножильный провод для печатных монтажей платы
Карточка документа - CEI EN 61189-5-3 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assembliesМетоды испытаний для электрических материалов, распечатанных досок и другой соединительной Части 5-3 структур и сборок: Общие методы испытаний для материалов и сборок - Спаивающий пасту для печатных монтажей платы
Карточка документа - CEI EN 62137-4 Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devicesЧасть 4 технологии сборки электроники: методы В виде испытания на выносливость для паяного соединения области выстраивают типовые планарно монтируемый компоненты пакета
Карточка документа - IEC 62326-20 Printed boards – Part 20: Printed circuit boards for high-brightness LEDs - Edition 1.0Печатные платы – Часть 20: Печатные платы для высокой яркости LEDs - Выпуск 1.0
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