IEC 60749-35 Semiconductor devices – Mechanical and climatic test methods – Part 35: Acoustic microscopy for plastic encapsulated electronic components - Edition 1.0
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC EN 60749-21 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
- 31
- CENELEC EN 61175-1 Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- IEC 60747-2 Semiconductor Devices - Discrete Devices and Integrated Circuits Part 2: Rectifier Diodes - Edition 2.0
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- BSI BS EN 60749-34 Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- IEC 60749-23 Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life - Edition 1.1 Consolidated Reprint
- CENELEC EN 60749-34 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- IEC 60749-3 CORR 1 SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 3: External visual examination CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- Картотека зарубежных и международных стандартов
International Electrotechnical Commission
Semiconductor devices – Mechanical and climatic test methods – Part 35: Acoustic microscopy for plastic encapsulated electronic components - Edition 1.0
N 60749-35
Annotation
This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
Автоматический перевод:
Полупроводниковые устройства – Механические и климатические методы тестирования – Часть 35: Акустическая микроскопия для пластмассы инкапсулировала электронные компоненты - Выпуск 1.0
Эта часть IEC 60749 определяет процедуры для выполнения акустической микроскопии на инкапсулировавших электронных компонентах пластмассы. Этот стандарт предоставляет руководство по использованию акустической микроскопии для обнаружения аномалий (отслоение, трещины, составные формой пустоты, и т.д.) восстанавливаемо и без разрушения в пластмассовых пакетах.
