CENELEC EN 60512-1 Connectors for Electronic Equipment - Tests and Measures Part 1: General
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19.040
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 29.020
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-2-2 Environmental testing -- Part 2-2: Tests - Tests B: Dry heat. (IEC 60068-2-2:2007)
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 61076-4-116 Connectors for electronic equipment - Product requirements - Part 4-116: Printed board connectors - Detail specification for a high-speed two-part connector with integrated shielding function - Incorporates Amendment A1: 2016
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- Картотека зарубежных и международных стандартов
На него ссылаются
- В списке элементов: 12
- CENELEC EN 60512-28-100 Connectors for electronic equipment - Tests and measurements - Part 28-100: Signal integrity tests up to 1 000 MHz on IEC 60603-7 and IEC 61076-3 series connectors - Tests 28a to 28gКоннекторы для электронного оборудования - Тесты и измерения - Часть 28-100: Целостность сигнала тестирует до 1 000 МГц на коннекторах серии IEC 60603-7 и IEC 61076-3 - Тесты 28a к 28 г
Карточка документа - CENELEC EN 62026-7 Low-voltage switchgear and controlgear - Controller-device interfaces (CDIs) - Part 7: CompoNetНизковольтная коммутационная аппаратура и controlgear - Устройства сопряжения прибора контроллера (CDIS) - Часть 7: CompoNet
Карточка документа - CENELEC EN 61076-3-110 Connectors for electronic equipment - Product requirements - Part 3-110: Detail specification for shielded, free and fixed connectors for data transmission with frequencies up to 1 000 MHzКоннекторы для электронного оборудования - требования продукта - Часть 3-110: Подробная спецификация для экранированных, свободных и фиксированных коннекторов для передачи данных с частотами до 1 000 МГц
Карточка документа - CENELEC EN 60512-16-21 Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stressesКоннекторы для электронного оборудования - Тесты и измерения - Часть 16-21: Механические испытания на контактах и завершениях - Тест 16u: тест Контактного усика с помощью приложения внешних механических напряжений
Карточка документа - CENELEC EN 60512-27-100 Connectors for electronic equipment - Tests and measurements - Part 27-100: Signal integrity tests up to 500 MHz on IEC 60603-7 series connectors - Tests 27a to 27gКоннекторы для электронного оборудования - Тесты и измерения - Часть 27-100: Целостность сигнала тестирует до 500 МГц на коннекторах серии IEC 60603-7 - Тесты 27a к 27 г
Карточка документа - DIN EN 60352-8 Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance (IEC 60352-8:2011)Соединения без пайки - Часть 8: Сжатие монтирует соединения - Общие требования, методы тестирования и практическое руководство (60352-8:2011 IEC)
Карточка документа - CENELEC EN 50548 Junction boxes for photovoltaic modules - Incorporates Amendment A1: 2013Распределительные коробки для фотогальванических модулей - Включают Поправку A1: 2013
Карточка документа - CENELEC EN 50521 Connectors for photovoltaic systems - Safety requirements and tests - Incorporates Amendment A1: 2012Соединители для фотогальванических систем - Требований техники безопасности и испытаний - Включают Поправку A1: 2012
Карточка документа - BSI BS EN 60512-13-5 Connectors for electronic equipment - Tests and measurements - Part 13-5: Mechanical operation tests - Test 13e: Polarizing and keying method - CORR: December 31, 2007Коннекторы для электронного оборудования - Тесты и измерения - Часть 13-5: Механические эксплуатационные испытания - Тест 13e: Поляризация и манипулирование метода - CORR: 31 декабря 2007
Карточка документа - BSI BS EN 60603-2 Harmonized system of quality assessment for electronic components - Connectors for Frequencies Below 3 MHz for Use with Printed Boards - Part 2: Detail Specification for Two-Part Connectors with Assessed Quality, for Printed Boards, for Basic Grid of 2,54 mm (0,1 in) with Common Mounting Features - AMD 15818: March 2006Согласованная система качественной оценки для электронных компонентов - Коннекторов для Частот Ниже 3 МГц для Использования с Печатными платами - Часть 2: Спецификация Детали для Коннекторов С двумя частями с Оцененным Качеством, для Печатных плат, для Основной Сетки 2,54 мм (0,1 в) с Общими Функциями Монтирования - AMD 15818: март 2006
Карточка документа - BSI BS EN 61076-3-101 Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 3: Rectangular connectors - Section 101: Detail specification for a range of shielded connectors with trapezoidal shaped shells and non-removable rectangular contacts on a 1,27 ? 2,54 mm centre-line - CORR: July 31, 2010Коннекторы с оцененным качеством, для использования в d.c., низкочастотный аналог и в цифровых высокоскоростных применениях данных - Часть 3: Прямоугольные коннекторы - Раздел 101: спецификация Детали для диапазона экранированных коннекторов с оболочками трапециевидной формы и несъемными прямоугольными контактами на геометрической оси на 1,27 ? 2,54 мм - CORR: 31 июля 2010
Карточка документа - BSI BS EN 60352-1 Solderless Connections - Part 1: Wrapped Connections - General Requirements, Test Methods and Practical Guidance - CORR 10406: February 2000Loetfreie связи. Соединения накруткой. Общие требования, методы испытания и прикладные указания - CORR 10 406: February в 2000
Карточка документа
