CENELEC EN 60191-6-12 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
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European Committee for Electrotechnical Standardization
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
N EN 60191-6-12
Annotation
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
Автоматический перевод:
Механическая стандартизация полупроводниковых устройств - Часть 6-12: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Руководство по проектированию для массива сетки земли с резьбой малого шага (FLGA)
Эта часть IEC 60191 предоставляет стандартные контурные рисунки, размерности и рекомендуемые изменения для всех пакетов массива сетки земли с резьбой малого шага (FLGA) с терминальной подачей 0,8 мм или меньше.
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