DIN EN 62047-3 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006)
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Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
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- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- ASTM D2122 Standard Test Method for Determining Dimensions of Thermoplastic Pipe and Fittings
- ASTM F2390 Standard Specification for Poly(Vinyl Chloride) (PVC) Plastic Drain, Waste, and Vent (DWV) Pipe and Fittings Having Post-Industrial Recycle Content
- ASTM F412 Standard Terminology Relating to Plastic Piping Systems
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM F412 Standard Terminology Relating to Plastic Piping Systems
- ASTM F2390 Standard Specification for Poly(Vinyl Chloride) (PVC) Plastic Drain, Waste, and Vent (DWV) Pipe and Fittings Having Post-Industrial Recycle Content
- ASTM F2390 Standard Specification for Poly(Vinyl Chloride) (PVC) Plastic Drain, Waste, and Vent (DWV) Pipe and Fittings Having Post-Industrial Recycle Content
- ASTM F412 Standard Terminology Relating to Plastic Piping Systems
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM F412 Standard Terminology Relating to Plastic Piping Systems
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- DIN EN 62047-22 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014)
- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- Картотека зарубежных и международных стандартов
