JSA JIS C 5630-3 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- JSA JIS C 5630-3 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
- 31
- JSA JIS C 5630-3 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
- 31.080
- JSA JIS C 5630-3 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
- 31.080.99
- JSA JIS C 5630-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- JSA JIS C 5630-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- JSA JIS C 5630-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
- Картотека зарубежных и международных стандартов
