BSI BS 123100-003 System of Quality Assessment - Capability Detail Specification - Rigid Single-Sided and Double-Sided Printed Boards with Plain Holes
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
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- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19.040
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 29.020
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-2-2 Environmental testing -- Part 2-2: Tests - Tests B: Dry heat. (IEC 60068-2-2:2007)
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- Картотека зарубежных и международных стандартов
Ссылается на
- В списке элементов: 7
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0Испытания на воздействия окружающих условий – Часть 2-54: Тесты – Тест Ta: тестирование Паяемости электронных компонентов балансовым методом смачивания - Выпуск 2.0
Карточка документа - BSI BS 123100 System of Quality Assessment - Sectional Specification - Rigid Single-Sided Printed Boards with Plain HolesСистема качественной оценки - частной спецификации - твердые односторонние печатные платы с простыми дырами
Карточка документа - BSI BS EN ISO 3543 Metallic and Non-Metallic Coatings - Measurement of Thickness - Beta Backscatter Method - CORR 16494: June 30, 2006Металлические и неметаллические покрытия - измерение толщины - бета метода обратного рассеяния - CORR 16494: 30 июня 2006
Карточка документа - IEC 60249-2-4 AMD 5 Amendment 5 Base Materials for Printed Circuits Part 2: Specifications Specification No. 4: Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet, General Purpose Grade - Edition 2.0Материалы основы поправки 5 для части 2 печатных схем: спецификация № 4 технических требований: эпоксид сотканная стеклянная ткань медно-одетый слоистый лист, сорт общего назначения - издание 2.0
Карточка документа - BSI BS EN 61188-1-2 Printed Boards and Printed Board Assemblies - Design and Use - Part 1-2: Generic Requirements - Controlled ImpedanceПечатные платы и блоки печатной платы - проект и использование - часть 1-2: универсальные требования - управляемый импеданс
Карточка документа - BSI BS QC 221100 Radio-frequency connectors - RF coaxial connectors with inner diameter of outer conductor 4,13 mm(0,163 in) with screwcoupling - Characteristic impedance 50 ohms (Type SMA)Разъемные соединения высокой частоты. Соединитель высокой частоты с внутренним диаметром внешнего провода 4,13 мм (0,163 '') с Schraubfesthaltung. Волновое сопротивление 50 омов (тип SMA)
Карточка документа - BSI BS EN 123000 Harmonized System of Quality Assessment for Electronic Components Generic Specification: Printed Boards - AMD 7145: May 1992; AMD 9249: September 1996; ADD: August 15, 1997Согласованная система качественной оценки для электронных компонентов универсальная спецификация: печатные платы - AMD 7145: май 1992; AMD 9249: сентябрь 1996; ADD: 15 августа 1997
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