BSI BS EN 60512-12-1 Connectors for electronic equipment Tests and measurements Part 12-1: Soldering tests Test 12a: Solderability, wetting, solder bath method
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- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- IEC 60068-2-58 Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 3.0
- 19
- IEC 60068-2-58 Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 3.0
- 19.040
- IEC 60068-2-58 Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 3.0
- 31
- IEC 60068-2-58 Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 3.0
- 31.190
- IEC 60068-2-58 Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 3.0
- BSI BS EN 60512-12-1 Connectors for electronic equipment Tests and measurements Part 12-1: Soldering tests Test 12a: Solderability, wetting, solder bath method
- 31.220
- BSI BS EN 60512-12-1 Connectors for electronic equipment Tests and measurements Part 12-1: Soldering tests Test 12a: Solderability, wetting, solder bath method
- BSI BS EN 60512-12-3 Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method - CORR 16986: March 30, 2007
- Картотека зарубежных и международных стандартов
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- BSI BS EN 50548 + A2 Junction boxes for photovoltaic modules - AMD: June 30, 2013; AMD: January 31, 2015Распределительные коробки для фотогальванических модулей - AMD: 30 июня 2013; AMD: 31 января 2015
Карточка документа - BSI BS EN 60512-12-3 Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method - CORR 16986: March 30, 2007Коннекторы для электронного оборудования - Тесты и измерения - Часть 12-2: Спаивание тестов - Тест 12b: Паяемость, смачивание, метод паяльника - CORR 16986: 30 марта 2007
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