BSI BS EN 60512-12-1 Connectors for electronic equipment Tests and measurements Part 12-1: Soldering tests Test 12a: Solderability, wetting, solder bath method
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Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- IEC 60068-2-58 Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 3.0
- 19
- IEC 60068-2-58 Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 3.0
- 19.040
- IEC 60068-2-58 Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 3.0
- 31
- IEC 60068-2-58 Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 3.0
- 31.190
- IEC 60068-2-58 Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 3.0
- BSI BS EN 60512-12-1 Connectors for electronic equipment Tests and measurements Part 12-1: Soldering tests Test 12a: Solderability, wetting, solder bath method
- 31.220
- BSI BS EN 60512-12-1 Connectors for electronic equipment Tests and measurements Part 12-1: Soldering tests Test 12a: Solderability, wetting, solder bath method
- BSI BS EN 60512-12-3 Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method - CORR 16986: March 30, 2007
- Картотека зарубежных и международных стандартов
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- IEC 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 4.0Испытания на воздействия окружающих условий - Часть 2-58: Тесты - Тест Td: Методы тестирования для паяемости, сопротивления роспуску металлизации и спаиванию тепла устройств монтажа на поверхность (SMD) - Выпуск 4.0
Карточка документа - IEC 60068-2-20 Environmental testing – Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads - Edition 5.0Испытания на воздействия окружающих условий – Часть 2-20: Тесты – Тест T: Методы испытаний для паяемости и сопротивления спаиванию тепла устройств с ведут - Издание 5.0
На основе IEC 60068-2-20 разработан ГОСТ Р МЭК 60068-2-20-2015 (IDT)ГОСТ Р МЭК 60068-2-20-2015 (IDT)
