IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
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Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
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- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
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- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- IEC 60191-6-20 Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ) - Edition 1.0
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- Картотека зарубежных и международных стандартов
International Electrotechnical Commission
Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
N 60191-6
Annotation
This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.
Автоматический перевод:
Механическая стандартизация полупроводниковых устройств – Часть 6: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Выпуск 3.0
Эта часть IEC 60191 дает общие правила для подготовки контурных рисунков surfacemounted полупроводниковых устройств. Это добавляет IEC 60191-1 и IEC 60191-3. Это покрывает все смонтированные поверхностью устройства дискретные полупроводники ведущим количеством больших или равных 8, а также интегральные схемы, классифицированные как форма E в Пункте 3 IEC 60191-4.
