DIN EN 62047-18 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013)
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
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- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- IEC 62047-2 Semiconductor devices – Micro-electromechanical devices – Part 2: Tensile testing method of thin film materials - Edition 1.0
- DIN EN 62047-18 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013)
- CENELEC EN 62047-6 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- Картотека зарубежных и международных стандартов
Deutsches Institut fur Normung e. V.
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013)
N EN 62047-18
Автоматический перевод:
Полупроводниковые устройства - Микроэлектромеханические устройства - Часть 18: методы Испытания на изгиб тонкопленочных материалов (62047-18:2013 IEC)
Данная часть Международной комиссии по электротехнике 62 047 устанавливает Biegepr fverfahren для тонких материалов слоя с длиной и шириной от соответственно менее 1 мм и толщины в области 0,1 m до 10 m. Тонкие материалы слоя используются как структурные основные материалы для микроэлектромеханических систем (в данном документе с MEMS сокращено) и микро-комплектующие изделия. Структурные основные материалы для MEMS, микро-комплектующих изделий владеют и т.д. особенными свойствами как масса в микронном диапазоне, методе изготовления материала посредством сепарации пара и фотолитографии и/или немеханическое редактирование микропроб.
Данная Международная норма устанавливает Biegepr fung и форму экзаменующегося как поверхностный отполированный cantileverf rmigen экзаменующийся с габаритами в микронном диапазоне, которые делает возможной точность, которая соответствует особенным свойствам.
