ASTM F2113 Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
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Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- ASTM F3166 Standard Specification for High-Purity Titanium Sputtering Target Used for Through- Silicon Vias (TSV) Metallization
- ASTM F1512 Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
- ASTM E1736 Standard Practice for Acousto-Ultrasonic Assessment of Filament-Wound Pressure Vessels
- ASTM E1001 Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
- ASTM F3192 Standard Specification for High-Purity Copper Sputtering Target Used for Through- Silicon Vias (TSV) Mettalization
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- Картотека зарубежных и международных стандартов
