ASTM E740/E740M Standard Practice for Fracture Testing with Surface-Crack Tension Specimens
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
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- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- 31.080
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- 31.080.99
- CENELEC EN 62047-8 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- CENELEC EN 62047-21 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
- ASTM E132 Standard Test Method for Poisson’s Ratio at Room Temperature
- ASTM E1012 Standard Practice for Verification of Testing Frame and Specimen Alignment Under Tensile and Compressive Axial Force Application
- ASTM E2899 Standard Test Method for Measurement of Initiation Toughness in Surface Cracks Under Tension and Bending
- Картотека зарубежных и международных стандартов
ASTM E740/E740M Standard Practice for Fracture Testing with Surface-Crack Tension Specimens
