DLA SMD-5962-90870 REV C MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL REGISTERED TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
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Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- ASTM D1039 Standard Test Methods for Glass-Bonded Mica Used as Electrical Insulation
- 29
- ASTM D1039 Standard Test Methods for Glass-Bonded Mica Used as Electrical Insulation
- 29.035
- ASTM D1039 Standard Test Methods for Glass-Bonded Mica Used as Electrical Insulation
- 29.035.50
- ASTM D1039 Standard Test Methods for Glass-Bonded Mica Used as Electrical Insulation
- ASTM F79 Standard Specification for Type 101 Sealing Glass
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- ASTM D257 Standard Test Methods for DC Resistance or Conductance of Insulating Materials
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- ASTM D2149 Standard Test Method for Permittivity (Dielectric Constant) And Dissipation Factor Of Solid Dielectrics At Frequencies To 10 MHz And Temperatures To 500°C
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- DLA SMD-5962-98580 REV N MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, SCHMITT 16-BIT BIDIRECTIONAL MULTI-PURPOSE TRANSCEIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
- DLA MIL-HDBK-780D CHANGE 2 STANDARD MICROCIRCUIT DRAWINGS
- Картотека зарубежных и международных стандартов
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- DLA MIL-HDBK-780D CHANGE 2 STANDARD MICROCIRCUIT DRAWINGSСТАНДАРТНЫЕ МИКРОСХЕМЫ ЧЕРТЕЖИ
Карточка документа - DLA MIL-HDBK-103AY LIST OF STANDARD MICROCIRCUIT DRAWINGSСПИСОК СТАНДАРТНЫХ МИКРОСХЕМ ЧЕРТЕЖИ
Карточка документа - DLA MIL-STD-883K CHANGE 2 TEST METHOD STANDARD MICROCIRCUITSМИКРОСХЕМЫ СТАНДАРТА МЕТОДА ТЕСТИРОВАНИЯ
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