IEC 60749-39 Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components - Edition 1.0
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Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
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- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- 31.080
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- 31.080.01
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- IEC 62572-3 Fibre optic active components and devices – Reliability standards – Part 3: Laser modules used for telecommunication - Edition 2.0
- IEC 60749-10 CORR 1 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- IEC 60749-10 CORR 1 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1 - Edition 1.0
- IEC 60749-10 CORR 1 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- IEC 60749-40 Semiconductor devices – Mechanical and climatic test methods – Part 40: Board level drop test method using a strain gauge - Edition 1.0
- IEC 60749-37 Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer - Edition 1.0
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- Картотека зарубежных и международных стандартов
На него ссылаются
- В списке элементов: 2
- IEC 60747-14-1 Semiconductor devices – Part 14-1: Semiconductor sensors – Generic specification for sensors - Edition 2.0Полупроводниковые устройства – Часть 14-1: Полупроводниковые датчики – Универсальная спецификация для датчиков - Выпуск 2.0
Карточка документа - BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heatПолупроводниковые устройства - Механические и климатические методы тестирования - Часть 20-1: Обработка, упаковка, маркировка и поставка планарно монтируемый компонентов, чувствительных к совместному воздействию влажности и спаивания тепла
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