BSI BS IEC 60191-1 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
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Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
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- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
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- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- Картотека зарубежных и международных стандартов
Ссылается на
- В списке элементов: 6
- IEC 60191-2 AMD 19 AMENDMENT 19 Mechanical standardization of semiconductor devices – Part 2: Dimensions - Edition 1.0Стандартизация Механического устройства AMENDMENT 19 полупроводниковых устройств – Часть 2: Размерности - Выпуск 1.0
Карточка документа - BSI BS EN ISO 5459 Geometrical product specifications (GPS) - Geometrical tolerancing - Datums and datum systemsГеометрические технические характеристики изделия (GPS) - Геометрический tolerancing - Данные и системы данной величины
Карточка документа - IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0Механическая стандартизация полупроводниковых устройств – Часть 6: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Выпуск 3.0
Карточка документа - IEC 60191-4 Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages - Edition 2.2: Edition 1.0: 1999 Consolidated with Amendments 1: 2001 and 2: 2002Механическая стандартизация полупроводниковых устройств - часть 4: кодирование системы и классификации в формы основ пакета для полупроводниковых пакетов устройства - издание 2.2: издание 1.0: 1999, объединенный с поправками 1: 2001 и 2: 2002
Карточка документа - BSI BS ISO 261 ISO general purpose metric screw threads - General planМетрическая изо винтовая резьба для общего применения. Обзор
Карточка документа - ISO 263 ISO Inch Screw Threads - General Plan and Selection for Screws, Bolts and Nuts - Diameter Range 0,06 to 6 in - First EditionВинтовая резьба дюйма ISO - общий план и выбор для винтов, болтов и гаек - диапазон диаметра 0,06 к 6 в - первый выпуск
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