CENELEC EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
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- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
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- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29.020
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-2-2 Environmental testing -- Part 2-2: Tests - Tests B: Dry heat. (IEC 60068-2-2:2007)
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC 60068-3-4 Environmental Testing - Part 3-4: Supporting Documentation and Guidance - Damp Heat Tests - Edition 1.0
- BSI BS EN 60127-6 Miniature fuses Part 6: Fuse-holders for miniature fuse-links
- CENELEC EN 60068-2-21 Environmental Testing - Part 2-21: Tests - Test U: Robustness of Terminations and Integral Mounting Devices
- BSI BS EN 62137-4 Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- Картотека зарубежных и международных стандартов
European Committee for Electrotechnical Standardization
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
N EN 60749-20-1
Автоматический перевод:
Полупроводниковые устройства - Механические и климатические методы тестирования - Часть 20-1: Обработка, упаковка, маркировка и поставка планарно монтируемый компонентов, чувствительных к совместному воздействию влажности и спаивания тепла
Эквиваленты данного стандарта:
- IEC 60749-20-1 Semiconductor devices – Mechanical and climatic test methods – Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat - Edition 1.0
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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