CEI EN 60749-15 Semiconductor devices - Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- 13
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- 13.160
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- 35
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- 35.100
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 61000-4-8 Electromagnetic compatibility (EMC) – Part 4-8: Testing and measurement techniques – Power frequency magnetic field immunity test - Edition 2.0
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- BSI BS EN 61582 Radiation protection instrumentation In vivo counters Classification, general requirements and test procedures for portable, transportable and installed equipment
- IEC 60721-3-5 Classification of Environmental Conditions Part 3: Classification of Groups of Environmental Parameters and Their Severities - Section 5: Ground Vehicle Installations - Edition 2.0
- CEI EN 61287-1 Railway applications - Power convertors installed on board rolling stock Part 1: Characteristics and test methods
- IEC 60747-15 Semiconductor devices – Discrete devices – Part 15: Isolated power semiconductor devices - Edition 2.0
- IEC 60749-5 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test - Edition 1.0; Replaces IEC/PAS 62161
- CEI EN 60747-15 Semiconductor devices - Discrete devices Part 15: Isolated power semiconductor devices
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- Картотека зарубежных и международных стандартов
Comitato Elettrotecnico Italiano
Semiconductor devices - Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices
N EN 60749-15
Annotation
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections.
This test is destructive and may be used for qualification, lot acceptance and as a product monitor.
This test is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements of semiconductors, the clauses of this standard apply.
Автоматический перевод:
Полупроводниковые устройства - Механическая и климатическая Часть 15 методов тестирования: Сопротивление спаиванию температуры для смонтированных устройств через дыру
Эта часть IEC 60749 описывает тест, используемый, чтобы определить, могут ли инкапсулированные твердотельные устройства, используемые для монтирования через дыру, противостоять эффектам температуры, которой они подвергаются во время спаивания их, ведет при помощи пайки волной припоя или паяльника.
