IEC 62047-14 Semiconductor devices – Micro-electromechanical devices – Part 14: Forming limit measuring method of metallic film materials - Edition 1.0
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- IEC 62047-14 Semiconductor devices – Micro-electromechanical devices – Part 14: Forming limit measuring method of metallic film materials - Edition 1.0
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International Electrotechnical Commission
Semiconductor devices – Micro-electromechanical devices – Part 14: Forming limit measuring method of metallic film materials - Edition 1.0
N 62047-14
Annotation
This part of IEC 62047 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 m to 300 m. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices.
When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.
Автоматический перевод:
Полупроводниковые устройства – Микроэлектромеханические устройства – Часть 14: Формирование предельного метода измерения металлических пленочных материалов - Выпуск 1.0
Эта часть IEC 62047 описывает определения и процедуры для измерения формовочного предела металлических пленочных материалов с диапазоном толщины от 0,5 m до 300 m. Металлические пленочные материалы, описанные здесь, обычно используются в электрических составляющих, MEMS и микроустройствах.
