IEC 62047-22 Semiconductor devices – Micro-electromechanical devices – Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates - Edition 1.0
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Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
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- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- ASTM F480 Standard Specification for Thermoplastic Well Casing Pipe and Couplings Made in Standard Dimension Ratios (SDR), SCH 40 and SCH 80
- ASTM D2122 Standard Test Method for Determining Dimensions of Thermoplastic Pipe and Fittings
- ASTM F2390 Standard Specification for Poly(Vinyl Chloride) (PVC) Plastic Drain, Waste, and Vent (DWV) Pipe and Fittings Having Post-Industrial Recycle Content
- ASTM F412 Standard Terminology Relating to Plastic Piping Systems
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM F412 Standard Terminology Relating to Plastic Piping Systems
- ASTM F2390 Standard Specification for Poly(Vinyl Chloride) (PVC) Plastic Drain, Waste, and Vent (DWV) Pipe and Fittings Having Post-Industrial Recycle Content
- ASTM D2122 Standard Test Method for Determining Dimensions of Thermoplastic Pipe and Fittings
- ASTM D2122 Standard Test Method for Determining Dimensions of Thermoplastic Pipe and Fittings
- ASTM F2390 Standard Specification for Poly(Vinyl Chloride) (PVC) Plastic Drain, Waste, and Vent (DWV) Pipe and Fittings Having Post-Industrial Recycle Content
- ASTM F412 Standard Terminology Relating to Plastic Piping Systems
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM F412 Standard Terminology Relating to Plastic Piping Systems
- ASTM F2390 Standard Specification for Poly(Vinyl Chloride) (PVC) Plastic Drain, Waste, and Vent (DWV) Pipe and Fittings Having Post-Industrial Recycle Content
- ASTM F2390 Standard Specification for Poly(Vinyl Chloride) (PVC) Plastic Drain, Waste, and Vent (DWV) Pipe and Fittings Having Post-Industrial Recycle Content
- ASTM F412 Standard Terminology Relating to Plastic Piping Systems
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM F412 Standard Terminology Relating to Plastic Piping Systems
- ASTM D2105 Standard Test Method for Longitudinal Tensile Properties of “Fiberglass” (Glass-Fiber- Reinforced Thermosetting-Resin) Pipe and Tube
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E4 Standard Practices for Force Verification of Testing Machines
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E855 Standard Test Methods for Bend Testing of Metallic Flat Materials for Spring Applications Involving Static Loading
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM E691 Standard Practice for Conducting an Interlaboratory Study to Determine the Precision of a Test Method
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM D7542 Standard Test Method for Air Oxidation of Carbon and Graphite in the Kinetic Regime
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM C1793 Standard Guide for Development of Specifications for Fiber Reinforced Silicon Carbide-Silicon Carbide Composite Structures for Nuclear Applications
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- ASTM E228 Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push- Rod Dilatometer
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-11 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- CENELEC EN 62047-3 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
- DIN EN 62047-12 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
- IEC 62047-3 Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing - Edition 1.0
- ASTM C600 Standard Test Method of Thermal Shock Test on Glass Pipe
- Картотека зарубежных и международных стандартов
International Electrotechnical Commission
Semiconductor devices – Micro-electromechanical devices – Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates - Edition 1.0
N 62047-22
Annotation
This part of IEC 62047 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.
Автоматический перевод:
Полупроводниковые устройства – Микроэлектромеханические устройства – Часть 22: Электромеханический метод испытания на растяжение для проводящих тонких пленок на гибких подложках - Выпуск 1.0
Эта часть IEC 62047 определяет метод испытания на растяжение для измерения электромеханических свойств проводящих тонких микроэлектромеханических систем (MEMS) материалы, связанные на непроводящих гибких подложках. Проводящие тонкопленочные структуры на гибких подложках экстенсивно используются в MEMS, потребительских товарах и гибкой электронике. Электрические поведения фильмов на гибких подложках отличаются от тех из автономного сбора фильмов и подложек к их граничным взаимодействиям. Различные комбинации гибких подложек и тонких пленок часто приводят к различным влияниям на результаты испытаний в зависимости от условий испытания и граничной адгезии. Желаемая толщина тонкого материала MEMS является на в 50 раз более тонкой, чем та из гибкой подложки, тогда как все другие размерности подобны друг другу.
