IEC 61760-1 Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs) - Edition 2.0
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
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- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
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- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-2-2 Environmental testing -- Part 2-2: Tests - Tests B: Dry heat. (IEC 60068-2-2:2007)
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- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29.020
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-2-2 Environmental testing -- Part 2-2: Tests - Tests B: Dry heat. (IEC 60068-2-2:2007)
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- Картотека зарубежных и международных стандартов
International Electrotechnical Commission
Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs) - Edition 2.0
N 61760-1
Annotation
This International Standard gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.
Object
The object of this standard is to ensure that a wide variety of SMDs (passive and active) can be subjected to the same placement and mounting processes during assembly. This standard defines tests and requirements that need to be part of any SMD component general, sectional or detail specification. In addition, this standard provides component users and manufacturers with a reference set of typical process conditions used in surface mount technology.
Автоматический перевод:
Технология монтажа на поверхность – Часть 1: Стандартный метод для спецификации компонентов монтажа на поверхность (SMDs) - Выпуск 2.0
Этот Международный стандарт дает множество элементарных исходов технологического режима и связанных условий испытания, которые будут использоваться при компиляции спецификаций компонента электронных компонентов, предназначающихся для использования в технологии монтажа на поверхность.



