JSA JIS C 5630-13 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- JSA JIS C 5630-18 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
- 31
- JSA JIS C 5630-18 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
- 31.080
- JSA JIS C 5630-18 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
- 31.080.99
- JSA JIS C 5630-6 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
- JSA JIS C 5630-6 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
- JSA JIS C 5630-6 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
- JSA JIS C 5630-2 Semiconductor devices - Micro-electromechanical devices-Part 2: Tensile testing method of thin film materials
- Картотека зарубежных и международных стандартов
