IEC TS 62132-9 Integrated circuits – Measurement of electromagnetic immunity – Part 9: Measurement of radiated immunity – Surface scan method - Edition 1.0
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- IEC TR 62433-2-1 EMC IC modelling – Part 2-1: Theory of black box modelling for conducted emission - Edition 1.0
- IEC 61967-6 CORR 1 Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method CORRIGENDUM 1 - Edition 1.1
- 31
- IEC TR 62433-2-1 EMC IC modelling – Part 2-1: Theory of black box modelling for conducted emission - Edition 1.0
- IEC 61967-6 CORR 1 Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method CORRIGENDUM 1 - Edition 1.1
- 31.200
- IEC TR 62433-2-1 EMC IC modelling – Part 2-1: Theory of black box modelling for conducted emission - Edition 1.0
- IEC 61967-6 CORR 1 Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method CORRIGENDUM 1 - Edition 1.1
- IEC TR 62433-2-1 EMC IC modelling – Part 2-1: Theory of black box modelling for conducted emission - Edition 1.0
- IEC TR 62433-2-1 EMC IC modelling – Part 2-1: Theory of black box modelling for conducted emission - Edition 1.0
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61010-1 Safety requirements for electrical equipment for measurement, control, and laboratory use – Part 1: General requirements - Edition 3.0; Incorporates Corrigendum 1: 05/2011 and Corrigendum 2: 10/2013 (Applies to French Text Only); Includes Interpretation 1: 02/2013
- IEC 62041 Safety of transformers, reactors, power supply units and combinations thereof – EMC requirements - Edition 2.0
- IEC CISPR 16-2-3 Specification for radio disturbance and immunity measuring apparatus and methods – Part 2-3: Methods of measurement of disturbances and immunity – Radiated disturbance measurements - Edition 3.2 Consolidated Reprint
- IEC 61967-2 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and wideband TEM cell method - Edition 1.0
- IEC TR 61967-4-1 Integrated circuits . Measurement of electromagnetic emissions, 150 kHz to 1 GHz . Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4 - Edition 1.0
- IEC 61967-6 CORR 1 Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method CORRIGENDUM 1 - Edition 1.1
- IEC TR 61967-4-1 Integrated circuits . Measurement of electromagnetic emissions, 150 kHz to 1 GHz . Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4 - Edition 1.0
- IEC 61967-2 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and wideband TEM cell method - Edition 1.0
- IEC CISPR 16-2-3 Specification for radio disturbance and immunity measuring apparatus and methods – Part 2-3: Methods of measurement of disturbances and immunity – Radiated disturbance measurements - Edition 3.2 Consolidated Reprint
- IEC 62041 Safety of transformers, reactors, power supply units and combinations thereof – EMC requirements - Edition 2.0
- IEC 61010-1 Safety requirements for electrical equipment for measurement, control, and laboratory use – Part 1: General requirements - Edition 3.0; Incorporates Corrigendum 1: 05/2011 and Corrigendum 2: 10/2013 (Applies to French Text Only); Includes Interpretation 1: 02/2013
- 13
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 61010-1 Safety requirements for electrical equipment for measurement, control, and laboratory use – Part 1: General requirements - Edition 3.0; Incorporates Corrigendum 1: 05/2011 and Corrigendum 2: 10/2013 (Applies to French Text Only); Includes Interpretation 1: 02/2013
- IEC 62041 Safety of transformers, reactors, power supply units and combinations thereof – EMC requirements - Edition 2.0
- IEC CISPR 16-2-3 Specification for radio disturbance and immunity measuring apparatus and methods – Part 2-3: Methods of measurement of disturbances and immunity – Radiated disturbance measurements - Edition 3.2 Consolidated Reprint
- IEC 61967-2 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and wideband TEM cell method - Edition 1.0
- IEC TR 61967-4-1 Integrated circuits . Measurement of electromagnetic emissions, 150 kHz to 1 GHz . Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4 - Edition 1.0
- IEC 61967-6 CORR 1 Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method CORRIGENDUM 1 - Edition 1.1
- IEC TR 61967-4-1 Integrated circuits . Measurement of electromagnetic emissions, 150 kHz to 1 GHz . Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4 - Edition 1.0
- IEC 61967-2 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and wideband TEM cell method - Edition 1.0
- IEC CISPR 16-2-3 Specification for radio disturbance and immunity measuring apparatus and methods – Part 2-3: Methods of measurement of disturbances and immunity – Radiated disturbance measurements - Edition 3.2 Consolidated Reprint
- IEC 62041 Safety of transformers, reactors, power supply units and combinations thereof – EMC requirements - Edition 2.0
- IEC 61010-1 Safety requirements for electrical equipment for measurement, control, and laboratory use – Part 1: General requirements - Edition 3.0; Incorporates Corrigendum 1: 05/2011 and Corrigendum 2: 10/2013 (Applies to French Text Only); Includes Interpretation 1: 02/2013
- CENELEC CLC/TR 62685 Industrial communication networks - Profiles - Assessment guideline for safety devices using IEC 61784-3 functional safety communication profiles (FSCPs)
- IEC 62041 Safety of transformers, reactors, power supply units and combinations thereof – EMC requirements - Edition 2.0
- IEC CISPR 16-2-3 Specification for radio disturbance and immunity measuring apparatus and methods – Part 2-3: Methods of measurement of disturbances and immunity – Radiated disturbance measurements - Edition 3.2 Consolidated Reprint
- IEC 61967-2 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and wideband TEM cell method - Edition 1.0
- IEC TR 61967-4-1 Integrated circuits . Measurement of electromagnetic emissions, 150 kHz to 1 GHz . Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4 - Edition 1.0
- IEC 61967-6 CORR 1 Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method CORRIGENDUM 1 - Edition 1.1
- IEC TR 61967-4-1 Integrated circuits . Measurement of electromagnetic emissions, 150 kHz to 1 GHz . Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4 - Edition 1.0
- IEC 61967-2 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and wideband TEM cell method - Edition 1.0
- IEC CISPR 16-2-3 Specification for radio disturbance and immunity measuring apparatus and methods – Part 2-3: Methods of measurement of disturbances and immunity – Radiated disturbance measurements - Edition 3.2 Consolidated Reprint
- IEC CISPR 16-2-3 Specification for radio disturbance and immunity measuring apparatus and methods – Part 2-3: Methods of measurement of disturbances and immunity – Radiated disturbance measurements - Edition 3.2 Consolidated Reprint
- IEC 61967-2 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and wideband TEM cell method - Edition 1.0
- IEC TR 61967-4-1 Integrated circuits . Measurement of electromagnetic emissions, 150 kHz to 1 GHz . Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4 - Edition 1.0
- IEC 61967-6 CORR 1 Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method CORRIGENDUM 1 - Edition 1.1
- IEC TR 61967-4-1 Integrated circuits . Measurement of electromagnetic emissions, 150 kHz to 1 GHz . Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4 - Edition 1.0
- IEC 61967-2 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and wideband TEM cell method - Edition 1.0
- IEC 61967-2 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and wideband TEM cell method - Edition 1.0
- IEC TR 61967-4-1 Integrated circuits . Measurement of electromagnetic emissions, 150 kHz to 1 GHz . Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4 - Edition 1.0
- IEC 61967-6 CORR 1 Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method CORRIGENDUM 1 - Edition 1.1
- IEC TR 61967-4-1 Integrated circuits . Measurement of electromagnetic emissions, 150 kHz to 1 GHz . Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4 - Edition 1.0
- IEC TR 61967-4-1 Integrated circuits . Measurement of electromagnetic emissions, 150 kHz to 1 GHz . Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4 - Edition 1.0
- IEC 61967-6 CORR 1 Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method CORRIGENDUM 1 - Edition 1.1
- IEC 61967-6 CORR 1 Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method CORRIGENDUM 1 - Edition 1.1
- IEC TS 62132-9 Integrated circuits – Measurement of electromagnetic immunity – Part 9: Measurement of radiated immunity – Surface scan method - Edition 1.0
- BSI PD IEC/TR 61967-1-1 Integrated circuits - Measurement of electromagnetic emissions Part 1-1: General conditions and definitions - Near-field scan data exchange format
- IEC TR 62433-2-1 EMC IC modelling – Part 2-1: Theory of black box modelling for conducted emission - Edition 1.0
- Картотека зарубежных и международных стандартов
International Electrotechnical Commission
Integrated circuits – Measurement of electromagnetic immunity – Part 9: Measurement of radiated immunity – Surface scan method - Edition 1.0
N TS 62132-9
Annotation
This part of IEC 62132 provides a test procedure, which defines a method for evaluating the effect of near electric, magnetic or electromagnetic field components on an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to testing an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan immunity between different ICs, the standardized test board defined in IEC 62132-1 should be used.
This measurement method provides a mapping of the sensitivity (immunity) to electric- or magnetic-near-field disturbance over the IC. The resolution of the test is determined by the capability of the test probe and the precision of the Probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. The tests described in this document are carried out in the frequency domain using continuous wave (CW), amplitude modulated (AM) or pulse modulated (PM) signals.
Автоматический перевод:
Интегральные схемы – Измерение электромагнитной неприкосновенности – Часть 9: Измерение излученной неприкосновенности – Поверхностного метода проверки - Выпуск 1.0



