BSI BS EN 61188-5-1 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
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Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
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- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- IEC 60721-3-0 Classification of environmental conditions Part 3: Classification of groups of environmental parameters and their severities Introduction - Edition 1.1 Consolidated Reprint
- BSI PD IEC TR 60721-4-1 Classification of Environmental Conditions - Part 4-1: Guidance for the Correlation and Transformation of Environmental Condition Classes of IEC 60721-3 to the Environmental Tests of IEC 60068 - Storage - AMD 14597: October 10, 2003
- IEC 60068-2-13 Basic Environmental Testing Procedures Part 2: Tests Test M: Low Air Pressure - Edition 4.0
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- IEC 60068-2-13 Basic Environmental Testing Procedures Part 2: Tests Test M: Low Air Pressure - Edition 4.0
- BSI PD IEC TR 60721-4-1 Classification of Environmental Conditions - Part 4-1: Guidance for the Correlation and Transformation of Environmental Condition Classes of IEC 60721-3 to the Environmental Tests of IEC 60068 - Storage - AMD 14597: October 10, 2003
- BSI PD IEC TR 60721-4-1 Classification of Environmental Conditions - Part 4-1: Guidance for the Correlation and Transformation of Environmental Condition Classes of IEC 60721-3 to the Environmental Tests of IEC 60068 - Storage - AMD 14597: October 10, 2003
- IEC 60068-2-13 Basic Environmental Testing Procedures Part 2: Tests Test M: Low Air Pressure - Edition 4.0
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- IEC 60068-2-13 Basic Environmental Testing Procedures Part 2: Tests Test M: Low Air Pressure - Edition 4.0
- BSI BS EN 60068-2-41 Environmental Testing - Part 2: Tests - Test Z/BM: Combined dry Heat/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-3-2 Environmental Testing - Part 3: Background Information - Section 2: Combined Temperature/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-40 Environmental Testing - Part 2: Tests - Test Z/AM: Combined Cold/Low Air Pressure Tests
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- BSI BS EN 60068-2-13 Environmental Testing - Part 2: Tests - Test M: Low Air Pressure
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC 60068-2-40 AMD 1 Amendment 1 Basic environmental testing procedures – Part 2-40: Tests – Test Z/AM: Combined cold/low air pressure tests - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC TR 62131-5 Environmental conditions - Vibration and shock of electrotechnical equipment - Part 5: Equipment during storage and handling - Edition 1.0
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- BSI BS EN 61760-1 Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides
- BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sides
- BSI BS EN 61188-5-1 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
- BSI BS EN 61188-5-3 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
- CENELEC HD 323.2.40 S1 Basic Environmental Testing Procedures - Part 2: Tests Test Z/AM: Combined Cold/Low Air Pressure Tests
- Картотека зарубежных и международных стандартов
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- BSI BS EN 61188-5-5 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sidesПечатные платы и блоки печатной платы - Проект и использование - Часть 5-5: Присоединение (земля/соединение) соображения - Компоненты с крылом типа "чайка" вовлекает четыре стороны
Карточка документа - BSI BS EN 61188-5-4 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sidesПечатные платы и блоки печатной платы - Проект и использование - Часть 5-4: Присоединение (земля/соединение) соображения - Компоненты с J вовлекает две стороны
Карточка документа - BSI BS EN 61188-5-3 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sidesПечатные платы и блоки печатной платы - Проект и использование - Часть 5-3: Присоединение (земля/соединение) соображения - Компоненты с крылом типа "чайка" вовлекает две стороны
Карточка документа - BSI BS EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sidesПечатные платы и Проект блоков печатной платы и Часть 5-6 использования: Присоединение (земля/соединение) Кристаллодержатели соображений с J-leads на четырех сторонах
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