DIN EN 62137-3 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011)
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- CENELEC EN 62321-3-2 Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- CENELEC EN 62137-1-2 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- 13
- CENELEC EN 62321-3-2 Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- CENELEC EN 62137-1-2 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- 13.020
- CENELEC EN 62321-3-2 Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- CENELEC EN 62137-1-2 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- CENELEC EN 62321-3-2 Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
- CENELEC EN 62321-3-2 Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
- 43
- CENELEC EN 62321-3-2 Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- CENELEC EN 62137-1-2 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- 43.040
- CENELEC EN 62321-3-2 Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- CENELEC EN 62137-1-2 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- 43.040.10
- CENELEC EN 62321-3-2 Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- CENELEC EN 62137-1-2 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- CENELEC EN 62321-3-2 Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
- CENELEC EN 62321-3-2 Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
- CENELEC EN 62321-3-2 Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
- BSI BS EN 62321-2 Determination of certain substances in electrotechnical products Part 2: Disassembly, disjointment and mechanical sample preparation
- CENELEC EN 62137-1-2 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
- CENELEC EN 62137-1-2 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
- DIN EN 62137-3 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011)
- CENELEC EN 62137-1-5 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
- CENELEC EN 62321-3-2 Determination of certain substances in electrotechnical products - Part 3-2: Screening - Total bromine in polymers and electronics by Combustion - Ion Chromatography
- Картотека зарубежных и международных стандартов
Ссылается на
- В списке элементов: 6
- CENELEC EN 62137-1-5 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue testТехнология монтажа на поверхность - Испытание на воздействие окружающей среды и методы в виде испытания на выносливость для паяных соединений монтажа на поверхность - Часть 1-5: Механическое испытание на усталость сдвига
Карточка документа - CENELEC EN 62137-1-2 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength testТехнология монтажа на поверхность - Испытание на воздействие окружающей среды и методы в виде испытания на выносливость для паяного соединения монтажа на поверхность - Часть 1-2: тест Прочности на сдвиг
Карточка документа - IEC 61188-5-2 Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987Печатные платы и Проект блоков печатной платы и Часть 5-2 использования: Присоединение (земля/соединение) Дискретные компоненты соображений - Выпуск 1.0; Замены Эд IEC 60321. 1.0: 1970 и IEC 60321-2 Эда. 1.0: 1987
На основе IEC 61188-5-2 разработан ГОСТ IEC 61188-5-2-2013 (IDT)ГОСТ IEC 61188-5-2-2013 (IDT) - CENELEC EN 61188-5-6 Printed boards and printed board assemblies Design and use Part 5-6: Attachment (land/joint) considerations Chip carriers with J-leads on four sidesПечатные платы и Проект блоков печатной платы и Часть 5-6 использования: Присоединение (земля/соединение) Кристаллодержатели соображений с J-leads на четырех сторонах
Карточка документа - IEC 61188-5-6 Printed Boards and Printed Board Assemblies - Design and Use - Part 5-6: Attachment (Land/Joint) Considerations - Chip Carriers with J-Leads on Four Sides - Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987Печатные платы и блоки Печатной платы - Проект и Использование - Часть 5-6: Присоединение (Земля/Соединение) Соображения - Кристаллодержатели с J-Leads на Четырех Сторонах - Выпуск 1.0; Замены Эд IEC 60321. 1.0: 1970 и IEC 60321-2 Эда. 1.0: 1987
На основе IEC 61188-5-6 разработан ГОСТ IEC 61188-5-6-2013 (IDT)ГОСТ IEC 61188-5-6-2013 (IDT) - IEC 61249-2-7 Materials for Printed Boards and Other Interconnecting Structures - Part 2-7: Reinforced Base Materials Clad and Unclad - Epoxide Woven E-Glass Laminated Sheet of Defined Flammability (Vertical Burning Test), Copper-Clad - Edition 1.0; Replaces IEC 60249 SeriesМатериалы для Печатных плат и Других Взаимосвязанных Структур - Часть 2-7: Усиленные Основные материалы, Одетые и Голые - Эпоксид Сотканное электронное Стекло Слоистый Лист Определенной Воспламеняемости (Вертикальный Горящий Тест), Медно-одетый - Выпуск 1.0; ряд IEC 60249 Замен
На основе IEC 61249-2-7 разработан ГОСТ Р МЭК 61249-2-7-2012 (IDT)ГОСТ Р МЭК 61249-2-7-2012 (IDT)
