BSI BS EN 60749-39 Semiconductor devices Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
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- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- 31.080
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- 31.080.01
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- IEC 62572-3 Fibre optic active components and devices – Reliability standards – Part 3: Laser modules used for telecommunication - Edition 2.0
- IEC 60749-10 CORR 1 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- IEC 60749-10 CORR 1 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1 - Edition 1.0
- IEC 60749-10 CORR 1 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1 - Edition 1.0
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- IEC 60749-40 Semiconductor devices – Mechanical and climatic test methods – Part 40: Board level drop test method using a strain gauge - Edition 1.0
- IEC 60749-37 Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer - Edition 1.0
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- Картотека зарубежных и международных стандартов
British Standards Institution
Semiconductor devices Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
N BS EN 60749-39
Автоматический перевод:
Полупроводниковые устройства Механическая и климатическая Часть 39 методов тестирования: Измерение диффузивности влажности и водной растворимости в органических материалах используется для полупроводниковых компонентов
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