IEC 61192-3 Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies - Edition 1.0
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 19
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 19.040
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-2-2 Environmental testing -- Part 2-2: Tests - Tests B: Dry heat. (IEC 60068-2-2:2007)
- 29
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29.020
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-2-2 Environmental testing -- Part 2-2: Tests - Tests B: Dry heat. (IEC 60068-2-2:2007)
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC 60068-3-4 Environmental Testing - Part 3-4: Supporting Documentation and Guidance - Damp Heat Tests - Edition 1.0
- IEC 60068-2-82 Environmental testing – Part 2-82: Tests – Test Tx: Whisker test methods for electronic and electric components - Edition 1.0; The contents of the corrigendum of December 2009 have been included
- Картотека зарубежных и международных стандартов
International Electrotechnical Commission
Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies - Edition 1.0
N 61192-3
Annotation
This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.
It applies to assemblies that are totally through-hole or mixed assemblies that include surfacemounting or other related assembly technologies, for example, terminals, wires.
Автоматический перевод:
Требования мастерства для спаянной электронной Части 3 блоков: монтажные узлы через дыру - Выпуск 1.0
Эта часть IEC 61192 определяет, что общие требования для мастерства в монтировании через дыру спаяли блоки на органических подложках на печатных платах, и на подобных ламинатах, присоединенных к поверхности (поверхностям) неорганических подложек.
Это применяется к блокам, которые являются или смешанными блоками полностью через дыру, включающими surfacemounting или другую связанную технологию сборки, например, терминалы, провода.
