BSI BS EN 60191-6 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
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- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
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- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 61230 Live working – Portable equipment for earthing or earthing and short-circuiting - Edition 2.0
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- IEC 60410 Sampling plans and procedures for inspection by attributes - Edition 1.0
- BSI BS EN 60679-1 Quartz crystal controlled oscillators of assessed quality Part 1: Generic specification
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- BSI BS EN 60679-3 Quartz Crystal Controlled Oscillators of Assessed Quality - Part 3: Standard Outlines and Lead Connections
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- IEC 60679-2 Quartz crystal controlled oscillators. Part 2: Guide to the use of quartz crystal controlled oscillators - Edition 1.0
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- BSI BS EN 61837-2 + A1 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures - AMD: August 31, 2014
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- CENELEC EN 61240 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- CENELEC EN 60191-6-22 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- IEC 60191-6 Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Edition 3.0
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- BSI BS EN 60191-6 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- BSI BS EN 60191-6-20 Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
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- BSI BS EN 60191-6-21 Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)Механическая стандартизация полупроводниковой Части 6-21 устройств: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Измеряющиеся методы для размерностей пакета малогабаритных корпусов (SOP)
Карточка документа - BSI BS EN 60191-6-20 Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)Механическая стандартизация полупроводниковой Части 6-20 устройств: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковые пакеты устройства - Измеряющиеся методы для размерностей пакета маленьких контурных J-выводных-корпусов (SOJ)
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